Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Baizhao Tan"'
Autor:
Bo Wu, Baizhao Tan, Guizhen Tan, Ming Zeng, Jinyi Luo, Guanghui Hu, Jiye Luo, Zhifeng Hao, Shaomei Lai, Binyun Liu
Publikováno v:
RSC Advances. 11:39153-39168
The green cyanide-free gold deposition is an important development direction in electroless gold plating. However, the commonly Au(i) based cyanide-free gold plating bath always suffers from severe corrosion to the Ni-P layer and unsatisfactory servi
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
In this study, the influence of chloride ion on the synergistic interaction and adsorption behavior of bis-(3-sulfopropyl) disulfide (SPS), polyethylene glycol (PEG) and TPM-1 in acidic electrolyte were investigated by the electrochemical measurement
Publikováno v:
Electrochimica Acta. 401:139445
Leveler is one of the most important additives for super-conformal copper electroplating, which has been widely applied in the fabrication of nanoscale (or microscale) interconnect features in integrated circuits (ICs) and printed circuit boards (PCB
Autor:
Baizhao Tan, Jiye Luo, Si Huang, Danqing Liu, Jiaoying Jin, Linlin Zhang, Dagang Wang, Lei Wang
Publikováno v:
Chemical Engineering Journal. 426:131859
Organic thermoelectric materials have attracted tremendous attention in virtue of their unique advantages including low thermal conductivity, low cost, easy processability and mechanical flexibility. Herein, a series of novel Spiro molecules are desi
Autor:
Guannan Yang, He Jun, Baizhao Tan, Zhen Li, Chengqiang Cui, Minghao Shi, Zhifeng Hao, Jiye Luo
Publikováno v:
Journal of The Electrochemical Society. 167:042508
Accelerators are indispensable additives for super-conformal copper electrodeposition, which has been widely applied in the fabrication of integrated circuits (ICs), printed circuit boards (PCBs), and advanced semiconductor packaging substrates. Curr
Autor:
Zhen Li, Baizhao Tan, Minghao Shi, Jiye Luo, Zhifeng Hao, Jun He, Guannan Yang, Chengqiang Cui
Publikováno v:
Journal of The Electrochemical Society; Mar2020, Vol. 167 Issue 4, p402-410, 9p