Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Baekkyu Choi"'
Autor:
Yong-Cheol Bae, Min-Su Ahn, Seong-Jin Jang, Joon-Young Park, Yoon-Joo Eom, Seokhong Kwon, Sang-Hyuk Yoon, Won Young Lee, Gyo-Young Jin, Seung-Jun Bae, Ki-Ho Kim, Baekkyu Choi, Jung-Hwan Choi, Daesik Moon, Jongmin Kim, Chang-Kyo Lee
Publikováno v:
VLSIC
A 6.4Gb/s TX-interleaving (TI) technique at sub-1V supply voltage is implemented with 25nm DRAM process for the future mobile DRAM interface which requires 51.2 GBps (2X Bandwidth of LPDDR4). A newly proposed 2-channel TX interleaving technique with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e2a47c6756f69c61761b693f4e175cb
https://doi.org/10.1109/vlsic.2015.7231254
https://doi.org/10.1109/vlsic.2015.7231254
Autor:
Sung-Joo Kim, Chanmin Jo, Sang Min Lee, Jaemin Shin, Baekkyu Choi, Seongjae Moon, Woonghwan Ryu
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Recent fast-evolving mobile system demands high bandwidth and low power consumption, necessitating extension of LPDDR3 beyond 1.6 Gbps. This demand, however, brings significant technical challenges from the perspective of signal and power integrity.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d60264c3abd75bbfc77b45fcb08e455
https://doi.org/10.1109/ectc.2014.6897588
https://doi.org/10.1109/ectc.2014.6897588
Autor:
Joungho Kim, Hyungsoo Kim, Seungyoung Ahn, Woonghwan Ryu, Baekkyu Choi, Namhoon Kim, Dong Gun Kam, Junwoo Lee
Publikováno v:
IEEE Transactions on Advanced Packaging. 23:398-407
With clock distribution of over 1 GHz, problems associated with clock skew, power consumption, and timing jitter are becoming critical for determining the processing speed of high-performance digital systems, especially for multi-processor systems. C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::131c395aa5fa5f56b7742da28c51e77c
https://doi.org/10.1109/6040.861553
https://doi.org/10.1109/6040.861553
Autor:
GaWon Kim, Max Sunghwan Min, Dinh T. Tran, Seung-Yong Cha, Se-ho You, Baekkyu Choi, Harold Bautista, Nian Zhou
Publikováno v:
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems.
In this paper, a DDR3L simulation topology for ARM SoC application is presented and the impact of the board power delivery network (PDN) on a DDR3L memory interface is simulated and analyzed. The analysis of the DDR3L PDN of the package and board wil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43758a8ff002b00651a5de033fcc2940
https://doi.org/10.1109/epeps.2013.6703502
https://doi.org/10.1109/epeps.2013.6703502
Autor:
Seungyoung Ahn, Junwoo Lee, Kwang Seong Choi, Joon-Ki Hong, Woonghwan Ryu, Jae Myun Kim, Heung-Sup Chun, Baekkyu Choi, Joungho Kim
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
A wafer level package (WLP) has been developed as a cost effective packaging method compared to the /spl mu/BGA package, and especially applied to the Rambus DRAM (RDRAM) package. The maximum allowable thickness of the stress buffer layer on the WLP
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4412456872232082828bbfcda794675d
https://doi.org/10.1109/ectc.2001.927707
https://doi.org/10.1109/ectc.2001.927707
Autor:
Kwang Seong Choi, Yongtae Kwon, Junwoo Lee, Joungho Kim, Myunghee Sung, Joon-Ki Hong, Namhoon Kim, Ikseong Park, Baekkyu Choi
Publikováno v:
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
As the operating frequency of systems increases above the gigahertz frequency range, the electrical performance of a package becomes more critical. Wafer level package (WLP) is a promising solution for future high-speed packaging needs. Because the l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9d591427dd57843a4dc036053f99f669
https://doi.org/10.1109/epep.2001.967623
https://doi.org/10.1109/epep.2001.967623
Autor:
Baekkyu Choi, Hyungsoo Kim, Woonghwan Ryu, Joungho Kim, Young-hwan Yun, Jonghoon J. Kim, Yong-Hee Lee, Soo-Hyung Kim, Seog-Heon Ham
Publikováno v:
2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).
The power/ground fluctuation is known as a significant source of radiated emission. We discuss the separated functions of on-PCB and on-chip decoupling capacitors on the suppression of electromagnetic radiated emission. Due to the different ranges of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66d4aff246464e26ef10289eaf74b0e8
https://doi.org/10.1109/isemc.2001.950698
https://doi.org/10.1109/isemc.2001.950698
Publikováno v:
IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).
We newly propose a multi-Gbit/sec clock distribution scheme to achieve minimized skew and jitter using RF interconnects. The proposed RF clock distribution scheme has successfully demonstrated less than 22 ps skew and less than 3 ps jitter at 2 GHz.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c7c314f10f43b94ff83c17194731ed0
https://doi.org/10.1109/epep.1999.819188
https://doi.org/10.1109/epep.1999.819188
Autor:
Junwoo Lee, Baekkyu Choi, Seungyoung Ahn, Woonghwan Ryu, Jae Myun Kim, Kwang Seong Choi, Joon-Ki Hong, Heung-Sup Chun, Joungho Kim
Publikováno v:
2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p128-132, 5p
Autor:
Myunghee Sung, Namhoon Kim, Junwoo Lee, Baekkyu Choi, Ikseong Park, Joon-Ki Hong, Yongtae Kwon, Kwang Seong Choi, Joungho Kim
Publikováno v:
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565); 2001, p109-112, 4p