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pro vyhledávání: '"Babu Suryadevara"'
Autor:
Babu Suryadevara
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The techno
Autor:
Babu Suryadevara
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to sh
Akademický článek
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Autor:
Hyosang Lee, B Patri Udaya, Goldstein Michael, Youngki Hong, Philipossian Ara, Economikos Laertis, V Babu Suryadevara
Publikováno v:
Transactions on Electrical and Electronic Materials. 8:5-10
Using a reference slurry, ammonium dodecyl sulfate (ADS), an anionic and environmentally friendly surfactant, was investigated as an alternative to BTA for its inhibition and lubrication characteristics. Results demonstrated that the inhibition effic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d74d22c0ca568315732d1d366e77bb3
https://doi.org/10.4313/teem.2007.8.1.005
https://doi.org/10.4313/teem.2007.8.1.005
Publikováno v:
ECS Transactions; April 2013, Vol. 50 Issue: 39 p73-79, 7p
Publikováno v:
Journal of Materials Research; 05/01/1992, Vol. 7 Issue 5, p1104-1114, 11p
Publikováno v:
Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 1992, Vol. 10 Issue 2, p284-289, 6p
Publikováno v:
AIChE Journal; Mar1991, Vol. 37 Issue 3, p367-376, 10p