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pro vyhledávání: '"Başım, Gül Bahar"'
Autor:
Basim, Gul Bahar.
Publikováno v:
Local Copy Licensed for access by UF students, faculty, and staff (and others in a UF library).
Thesis (Ph. D.)--University of Florida, 2002.
Title from title page of source document. Includes vita. Includes bibliographical references.
Title from title page of source document. Includes vita. Includes bibliographical references.
Autor:
Basim, Gul Bahar Jr.
Fine coal constitutes a relatively small portion of a product stream in a coal cleaning plant. However, its processing cost is approximately three times higher than the cost of processing coarse coal. Therefore, many coal companies chose to discard t
Externí odkaz:
http://hdl.handle.net/10919/35680
http://scholar.lib.vt.edu/theses/available/etd-111297-161536/
http://scholar.lib.vt.edu/theses/available/etd-111297-161536/
Akademický článek
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Akademický článek
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Due to copyright restrictions, the access to the full text of this article is only available via subscription. In this study, a systematic experimental approach has been followed to determine the conditions to promote material removal rate while cont
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1862::19a3b24e3b3ded35ad6bcc327bed537b
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?reload=true&arnumber=7412000
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?reload=true&arnumber=7412000
Autor:
Başım, Gül Bahar, Özdemir, Zeynep
Due to copyright restrictions, the access to the full text of this article is only available via subscription. In this study, chemical mechanical polishing (CMP) technique is introduced as a new alternative to generate controlled nano/micro scale rou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1862::59afbd7da85d6528171f4af98618204e
https://hdl.handle.net/10679/2791
https://hdl.handle.net/10679/2791
Autor:
Dumitrescu, I., Iordache, O., Popescu, A., Varzaru, E., Kim, S., Başım, Gül Bahar, Ükelge, G.
The research has been focused on the photocatalytic activity of the textile materials treated with TiO2 and TiO2 iron doped by pad-dry-cure and cationization - pad-dry-cure. The fabrics have been exposed to UV and visible light. The photocatalytic ef
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1862::4ef12efcde2a70a38db5604c0cb94b5b
https://hdl.handle.net/10679/4276
https://hdl.handle.net/10679/4276
Due to copyright restrictions, the access to the full text of this article is only available via subscription. Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1862::5240b4a4b5162d9a069ca67d20382c01
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6353813
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6353813
Publikováno v:
ECS Meeting Abstracts. :2493-2493
Due to copyright restrictions, the access to the full text of this article is only available via subscription. This paper focuses on the planarization of metallic films in microelectronics manufacturing by CMP through investigation of metal oxide thi
Autor:
Ayse Karagoz, G. Bahar Basim
Publikováno v:
ECS Transactions. 72:67-72
This study targeted to create a basis for the new generation semiconductor industry that deals with atomic scale devices and also expected to be utilized in many other fields such as advanced coatings, interfacial adhesion, biological systems i.e. co