Zobrazeno 1 - 10
of 19
pro vyhledávání: '"BUCHMAN, Attila"'
Publikováno v:
Carpathian Journal of Electronic and Computer Engineering. 14:11-14
This article introduces a basic LED control using the USB6001 hardware, which is a LabVIEW product. It may be thought of as an extension device for real-time testing of simulation results. LabVIEW2014 is the software used. TCP is the communication te
Publikováno v:
Carpathian Journal of Electronic and Computer Engineering. 11:50-55
Jordan which is located in the heart of the world contains hundreds of historical and archaeological locations that have a supreme potential in enticing visitors. The impact of clime is important on many aspects of life such as the development of tou
Autor:
Yu Xie, Buchman, Attila
Publikováno v:
Carpathian Journal of Electronic & Computer Engineering; Dec2021, Vol. 14 Issue 2, p15-19, 5p
Autor:
Xie, Yu, Buchman, Attila
Publikováno v:
Carpathian Journal of Electronic and Computer Engineering; December 2021, Vol. 14 Issue: 2 p15-19, 5p
Autor:
Buchman, Attila, Lung, Claudiu
Publikováno v:
Carpathian Journal of Electronic and Computer Engineering, Vol 6, Iss 2, Pp 15-20 (2013)
Every WiFi, ZigBee or Bluetooth compatible radio chip provides a byte of information related to the received signal strength (RSS), the so called received signal strength index (RSSI). In a given point in space, on a specific radio channel, the RSS h
Autor:
Claudiu Lung, Buchman Attila
Publikováno v:
Carpathian Journal of Electronic and Computer Engineering, Vol 5, Iss 1, Pp 67-70 (2012)
This paper presents a useful software tool for projects with multi PicoBlaze microprocessors implemented in FPGA circuits. Application presented in this paper which use for software development PicoBlaze SDK tool is an Automatic Packet Report System
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::34b26d9ae559e35e667b334de6f1bb8b
Publikováno v:
2016 IEEE 22nd International Symposium for Design & Technology in Electronic Packaging (SIITME); 2016, p240-243, 4p
Publikováno v:
2015 IEEE 21st International Symposium for Design & Technology in Electronic Packaging (SIITME); 2015, p315-318, 4p