Zobrazeno 1 - 10
of 51
pro vyhledávání: '"BORD MAJEK Isabelle"'
Autor:
Chenniki, Walide, Bord-Majek, Isabelle, Louarn, Mélanie, Gaud, Vincent, Diot, Jean-Luc, Wongtimnoi, Komkrisd, Ousten, Yves
Publikováno v:
In Microelectronics Reliability December 2015 55(12) Part B:2793-2798
Publikováno v:
Journal of Engineering; Sep2023, Vol. 2023 Issue 9, p1-8, 8p
Publikováno v:
Journal of Engineering; Jan2023, Vol. 2023 Issue 1, p1-9, 9p
Autor:
Yves Ousten, BORD MAJEK Isabelle
Publikováno v:
SIA SFIP Materials for Future Mobility 2021
SIA SFIP Materials for Future Mobility 2021, Feb 2021, Bordeaux (Digital Edition), France
HAL
SIA SFIP Materials for Future Mobility 2021, Feb 2021, Bordeaux (Digital Edition), France
HAL
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::eb0fceb621cbac1633bfe7030984466c
https://hal.archives-ouvertes.fr/hal-03194659
https://hal.archives-ouvertes.fr/hal-03194659
Autor:
Emmanuel Tetsi, Gilles Philippot, BORD MAJEK Isabelle, Cyril Aymonier, Jean Audet, Roxan Lemire, Laurent Bechou, Dominique Drouin
Publikováno v:
44th International Conference on Micro and Nanoengineering (MNE 2018)
44th International Conference on Micro and Nanoengineering (MNE 2018), Sep 2018, Copenhague, Denmark
HAL
44th International Conference on Micro and Nanoengineering (MNE 2018), Sep 2018, Copenhague, Denmark
HAL
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::b2c00b467342327bb392206bead5b19d
https://hal.archives-ouvertes.fr/hal-01957047
https://hal.archives-ouvertes.fr/hal-01957047
Autor:
Emmanuel Tetsi, Gilles Philippot, BORD MAJEK Isabelle, Cyril Aymonier, Jean Audet, Laurent Bechou, Dominique Drouin
Publikováno v:
Proceedings of the 6th Electronics System-Integration Technology Conference (ESTC 2016)
6th Electronics System-Integration Technology Conference (ESTC 2016)
6th Electronics System-Integration Technology Conference (ESTC 2016), Sep 2016, Grenoble, France. p 367
HAL
6th Electronics System-Integration Technology Conference (ESTC 2016)
6th Electronics System-Integration Technology Conference (ESTC 2016), Sep 2016, Grenoble, France. p 367
HAL
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::fe17257ba791fbdf46a760c1af0cc02d
https://hal.archives-ouvertes.fr/hal-01566969
https://hal.archives-ouvertes.fr/hal-01566969
Autor:
Tetsi, E., Gilles Philippot, BORD MAJEK Isabelle, Aymonier, C., Audet, J., Béchou, L., Drouin, D.
Publikováno v:
Journées Nationales du Réseau Doctoral de Microélectronique (JNRDM)
Journées Nationales du Réseau Doctoral de Microélectronique (JNRDM), May 2016, Toulouse, France. pp.93
HAL
Journées Nationales du Réseau Doctoral de Microélectronique (JNRDM), May 2016, Toulouse, France. pp.93
HAL
National audience; Dans le contexte de l’intégration 3D des composants électroniques avec un objectif de miniaturisation et d’augmentation des vitesses de traitement de l’information, l’ajout de condensateurs de découplage à proximité de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::7273fcbf4fe24ceb1b0496ac2959c29c
https://hal.archives-ouvertes.fr/hal-01349015
https://hal.archives-ouvertes.fr/hal-01349015
Autor:
Raphael Baillot, Laurent Bechou, BORD MAJEK Isabelle, Marianne Consonni, Yannick Deshayes, Gasse Adrien
Publikováno v:
[Rapport de recherche] BPI FRANCE. 2015
HAL
HAL
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::3cc8fc5349a3ceca151699d457bbd2dc
https://hal.science/hal-01222174
https://hal.science/hal-01222174
Publikováno v:
HAL
Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015)
Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015), Mar 2015, Sitges, Spain
Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015)
Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015), Mar 2015, Sitges, Spain
International audience; Embedded passive components (into printed circuit board) can improve electrical performances (high frequency especially), reduce volume, weight and assembly cost. Moreover the reliability of embedded passives is significantly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::319213a1689381dd9d7c6a827b25d760
https://hal.archives-ouvertes.fr/hal-01188929
https://hal.archives-ouvertes.fr/hal-01188929