Zobrazeno 1 - 2
of 2
pro vyhledávání: '"BONDWIRE DEGRADATION"'
Autor:
Nicolas Degrenne, Zoubir Khatir, Stefan Mollov, Damien Ingrosso, Ali Ibrahim, Nausicaa Dornic
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2020, 114, 7p. ⟨10.1016/j.microrel.2020.113873⟩
Microelectronics Reliability, Elsevier, 2020, 114, pp.113873. ⟨10.1016/j.microrel.2020.113873⟩
Microelectronics Reliability, Elsevier, 2020, 114, 7p. ⟨10.1016/j.microrel.2020.113873⟩
Microelectronics Reliability, Elsevier, 2020, 114, pp.113873. ⟨10.1016/j.microrel.2020.113873⟩
ESREF 2020, 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ATHENES, GRECE, -; This paper focuses on the degradation at the wire bond contact with the metalized pad, and precisely its evolution with the power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::18caf42364a94183b01b667d936c39de
https://hal.archives-ouvertes.fr/hal-03147217
https://hal.archives-ouvertes.fr/hal-03147217
Autor:
Stefan Mollov, Richard Lallemand, Zoubir Khatir, D. Ingrosso, Jean-Pierre Ousten, Nicolas Degrenne, Ali Ibrahim
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2020, 114, 7p. ⟨10.1016/j.microrel.2020.113757⟩
ESREF 2020, 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
ESREF 2020, 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2020, Athènes, Greece. ⟨10.1016/j.microrel.2020.113757⟩
Microelectronics Reliability, Elsevier, 2020, 114, 7p. ⟨10.1016/j.microrel.2020.113757⟩
ESREF 2020, 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
ESREF 2020, 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2020, Athènes, Greece. ⟨10.1016/j.microrel.2020.113757⟩
ESREF 2020, 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Athènes, GRECE, 05-/10/2020 - 07/10/2020; This paper investigates the use of wire?bonds contact resistance as indicator to diagnose the health stat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::89838b29e2fe84eb89fd1abe7d0f3a05
https://hal.archives-ouvertes.fr/hal-03150061
https://hal.archives-ouvertes.fr/hal-03150061