Zobrazeno 1 - 10
of 40
pro vyhledávání: '"B.S.S Chandra Rao"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6818886b731363bc96dcec6d5b98d47
https://doi.org/10.1109/eptc56328.2022.10013128
https://doi.org/10.1109/eptc56328.2022.10013128
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a73e95812db459135f2e5335b321692c
https://doi.org/10.1109/eptc56328.2022.10013182
https://doi.org/10.1109/eptc56328.2022.10013182
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::083fc19e4af2d198396e600a229fdce5
https://doi.org/10.1109/eptc56328.2022.10013133
https://doi.org/10.1109/eptc56328.2022.10013133
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b883c278aef0c53a70331e61d2f05448
https://doi.org/10.1109/eptc56328.2022.10013198
https://doi.org/10.1109/eptc56328.2022.10013198
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::acbbba309708f7f9cb367aa031ffff87
https://doi.org/10.1109/eptc53413.2021.9663912
https://doi.org/10.1109/eptc53413.2021.9663912
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5bbcc9342bd49b7137054c8698af69b
https://doi.org/10.1109/eptc53413.2021.9663932
https://doi.org/10.1109/eptc53413.2021.9663932
Publikováno v:
Transactions of the Indian Institute of Metals. 71:1497-1505
The effect on mechanical properties and microstructure of SAC 387 lead free solder alloys by addition of 1 wt% Au nanoparticles was studied. Also the effect on tensile properties at different temperatures and strain rates was investigated. The powder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a19270dfd47310c127fc5fd883c7409
https://doi.org/10.1007/s12666-018-1285-0
https://doi.org/10.1007/s12666-018-1285-0
Publikováno v:
Journal of Alloys and Compounds. 542:136-141
The effect of addition of nano-sized Ni and Mo particles on creep behavior of Sn–3.5Ag lead free solder alloy was investigated using a constant load method in a nanoindenter. Modified Garofalo’s equation was found to show an excellent fit to inde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c527d60161e91207ab6c75e4311adc6
https://doi.org/10.1016/j.jallcom.2012.07.044
https://doi.org/10.1016/j.jallcom.2012.07.044
Publikováno v:
Materials Science and Engineering: A. 529:257-264
The effect of temperature and strain rate on the tensile properties of Sn–3.8Ag–0.7Cu (SAC387) alloy as well as SAC387 alloy reinforced with two different weight percentages (wt.%) of SWCNT was investigated. It was found that addition of 0.05 wt.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7028d590efe87933f1a9a5dbcdd1c710
https://doi.org/10.1016/j.msea.2011.09.026
https://doi.org/10.1016/j.msea.2011.09.026
Publikováno v:
Materials Science and Engineering: A. 528:4166-4172
In this work, tensile deformation of Sn–3.8Ag–0.7Cu (SAC387) solder and composite of SAC387 reinforced with nano-sized Mo particles have been studied with strain rates from 10−5 to 10−1 s−1 and temperatures of 25, 75 and 125 °C. It is foun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e32d8c4363661d7f285192c65341199c
https://doi.org/10.1016/j.msea.2011.01.115
https://doi.org/10.1016/j.msea.2011.01.115