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Autor:
G. Cardoso, J. Andresen, J.A. Appel, D.C. Christian, B.K. Hall, S.W. Kwan, M.A. Turqueti, S. Zimmermann
Publikováno v:
IEEE Transactions on Nuclear Science. 51:2168-2173
Autor:
B.K. Hall, S. Cihangir, S. Zimmermann, M. Turqueti, G. Cardoso, Simon Kwan, J.A. Appel, D. C. Christian
Publikováno v:
IEEE Transactions on Nuclear Science. 51:2161-2167
The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the behavior of
Autor:
G. Cardoso, B.K. Hall, R.J. Yarema, D. C. Christian, S. Zimmermann, Simon Kwan, J.A. Appel, J. Hoff, A. Mekkaoui
Publikováno v:
IEEE Transactions on Nuclear Science. 49:1185-1189
The pixel detector for the BTeV experiment at Fermilab provides digitized data from approximately 22 million silicon pixel channels. Portions of the detector are six millimeters from the beam providing a substantial hit rate and high radiation dose.
Autor:
B.K. Hall, R.J. Yarema, Simon Kwan, J. Andresen, G. Chiodini, A. Mekkaoui, G. Cardoso, J.A. Appel, S. Zimmermann, S. Cihangir, J. Hoff, D. C. Christian
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:36-42
At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The backs of the ICs
Autor:
B.K. Hall, J.A. Appel, G. Cardoso, D. Christian, J. Hoff, S. Kwan, A. Mekkaoui, R. Yarema, S. Zimmermann
Publikováno v:
2001 IEEE Nuclear Science Symposium Conference Record (Cat. No.01CH37310).
Autor:
G. Cardoso, J.A. Appel, Simon Kwan, B.K. Hall, D. C. Christian, M. Turqueti, S. Cihangir, S. Zimmermann
Publikováno v:
2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515).
At Fermilab, a research program to develop a pixel detector for the BTeV experiment has been ongoing for the last several years. The basic building block of the pixel detector is the pixel multichip module. Prototypes have been built and characteriza
Autor:
B.K. Hall, G. Alimonti, Dario Menasce, S. Magni, Gabriele Chiodini, Lorenzo Uplegger, D. Zhang
Publikováno v:
Scopus-Elsevier
Pomone is a flexible read-out system, designed in the context of the BTeV pixel test beam, based upon a PCI-compliant board and a custom-built mezzanine card to accommodate different detector front-end components. The system consists of a rich set of
Autor:
G. Cancelo, J. Andresen, J.A. Appel, J. Hoff, P. A. Kasper, B.K. Hall, A. Mekkaoui, R.J. Yarema, S. Cihangir, D. C. Christian, S. Zimmermann, Simon Kwan, G. Cardoso, R.W. Downing
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor arr
Phosphorus (P) deficiency in the diet of teleost fishes decreases the mineral content of bone. The present study investigated the changes in the microanatomy and metabolism of acellular-boned juvenile haddock (Melanogrammus aeglefinus L.) in relation
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https://nrc-publications.canada.ca/eng/view/object/?id=0594667a-247e-49ed-bcf0-9ddb71c31156
https://nrc-publications.canada.ca/eng/view/object/?id=0594667a-247e-49ed-bcf0-9ddb71c31156