Zobrazeno 1 - 10
of 56
pro vyhledávání: '"B. Sane"'
Autor:
Ravi Mahajan, Ankur Agrawal, James E. Jaussi, Joshua B. Fryman, Zhichao Zhang, Sandeep B. Sane, Arnab Sarkar, Priyanka Dobriyal, Chia-Pin Chiu, Srikant Nekkanty, Li Xiaoqian, Kaveh Hosseini, Thomas Nordstog, Suresh Pothukuchi, Pooya Tadayon, Susheel G. Jadhav, Sushrutha Gujjula, Vanessa Pogue, Abhishek Singh, Kemal Aygun, Nitin Deshpande, David Hui, Sergey Y. Shumarayev, Andrew Alduino
Publikováno v:
Journal of Lightwave Technology. 40:379-392
Photonics die or integrated photonics modules co-packaged with compute engines have the potential to deliver significant improvements in power, bandwidth and reach needed to meet the computing and communication demands of data centers and other high-
Autor:
Shubhada H. Sahasrabudhe, Scott Mokler, Owen Jin, Nilesh Badwe, Pubudu Goonetilleke, Eric Brigham, Kevin Byrd, Satish Parupalli, Sandeep B. Sane, M. Renavikar
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Intel's commitment to the environment continues with a breakthrough technology – Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will
Publikováno v:
Indian journal of dermatology and venereology. 39(2)
Publikováno v:
Jàmbá: Journal of Disaster Risk Studies. 9
Food security is a serious challenge facing West African countries because most croplands are being degraded. Consequently, agricultural production is being exceeded by rapid population growth. This study relates the dynamics of agricultural lands to
Autor:
Nachiket R. Raravikar, Amaneh Tasooji, Sandeep B. Sane, Ali Fallah-Adl, Ravi Mahajan, Richard J. Harries
Publikováno v:
International Symposium on Microelectronics. 2011:000223-000231
The work presented here is one of the key elements of an integrated methodology for predicting reliability in packaging systems (IMPRPK) developed by Arizona State University (ASU) and Intel. IMPRPK approach is based on a probabilistic methodology, f
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Autor:
B. Sane, Fabrice Courtin, Gérard Cuny, Vincent Jamonneau, D. G. Zeze, B. Coulibaly, Philippe Solano, S. Dupont
Publikováno v:
Tropical Medicine and International Health. 10:340-346
Resume La Trypanosomose Humaine Africaine (THA) est une maladie parasitaire a transmission vectorielle, qui a souvent ete decrite comme une maladie rurale. L'augmentation de la population accompagnee par un exode rural massif dans les pays africains
Publikováno v:
Journal of Computer-Aided Materials Design. 8:87-106
The results of molecular dynamics computations and corresponding values of laboratory measurements are compared to assess the efficacy of the numerical method. Details are presented on the modeling process, including the selection of an appropriate f
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Organic substrates in electronic packaging are made of laminated dielectric and plated copper layers surrounding a fiber-reinforced glass core. Their constituent materials have typically been assumed to be linear elastic for simplicity in the microel
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
Viscoelastic analysis for numerical modeling of IC assembly processes are generally non-linear and require extensive time and computational resources when compared to a linear elastic analysis. Experimental identification/approximation of the viscoel