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Models of printed boards for solderless mounting of electronic components by foil perforation method
Autor:
A. A. Yefimenko, B. P. Paliukh
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 4-5, Pp 3-9 (2017)
The paper presents models of printed circuit boards for an improved foil perforation method. The density of electrical connections of such printed circuit boards is estimated in comparison with circuit boards obtained using the methods of mounting in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::abe41faa18dbf336a423c476a5967964
https://doi.org/10.15222/tkea2017.4-5.03
https://doi.org/10.15222/tkea2017.4-5.03
