Zobrazeno 1 - 10
of 68
pro vyhledávání: '"B. Oberhofer"'
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Thermo-Sonic Flip Chip Bonding (TS-FCB) is an already established technology for chip on wafer (CoW) applications in the industry. As a very fast and reliable interconnection process [1] it has been chosen for this project to temporarily tack small a
Publikováno v:
Acta Radiologica. 40:17-26
Publikováno v:
Acta Radiologica. 40:17-26
Autor:
V. Gvozdanovic, B. Oberhofer
Publikováno v:
Acta Radiologica. 40:395-407
Autor:
B, Oberhofer, A, Georgijević
Publikováno v:
Lijecnicki vjesnik. 98(1)
Publikováno v:
Acta chirurgica Iugoslavica. 25
Publikováno v:
Acta chirurgica Iugoslavica. 22(1)
Autor:
B, Oberhofer, A, Bolanca
Publikováno v:
Lijecnicki vjesnik. 97(12)
Autor:
A, Georgijevic, B, Oberhofer
Publikováno v:
Lijecnicki vjesnik. 98(12)
Publikováno v:
Acta chirurgica Iugoslavica. 26(2)
Authors ten years experience and results in the surgical treatment of the gastroduodenal ulcer on Surgical clinic "Dr. M.Stojanovic" in Zagreb is esposed. During this period 1226 patients with the gastroduodenal ulcer operated, 804 from them with chr