Výsledky vyhledávání - "B. Oberhofer"

High throughput two-stage bonding technique for advanced wafer level packaging

Autor: B. Oberhofer, T. Sonoda, V. Rangelov, S. Altenbockum

Publikováno v: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Thermo-Sonic Flip Chip Bonding (TS-FCB) is an already established technology for chip on wafer (CoW) applications in the industry. As a very fast and reliable interconnection process [1] it has been chosen for this project to temporarily tack small a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::686916fcbb84eeda575e19bf2ce7be25
https://doi.org/10.23919/empc44848.2019.8951877

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Akademický článek

Concurrent validity of novel smartphone-based apps monitoring barbell velocity in powerlifting exercises.

Autor: Renner, Alexander¹ (AUTHOR) alexander.renner@univie.ac.at, Mitter, Benedikt² (AUTHOR), Baca, Arnold¹ (AUTHOR)

Publikováno v: PLoS ONE. 11/19/2024, Vol. 19 Issue 11, p1-16. 16p.

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Akademický článek

Comparing Video Analysis to Computerized Detection of Limb Position for the Diagnosis of Movement Control during Back Squat Exercise with Overload.

Autor: Peres, André B.^1,2 (AUTHOR) andreperes@ifsp.edu.br, Sancassani, Andrei² (AUTHOR) andreisanca@hotmail.com, Castro, Eliane A.^2,3 (AUTHOR) elianeaparecidacastro@gmail.com, Almeida, Tiago A. F.^3,4 (AUTHOR) tiagofalmeida.w@gmail.com, Massini, Danilo A.^2,3 (AUTHOR) dmassini@hotmail.com, Macedo, Anderson G.^2,3,5 (AUTHOR) andersongmacedo@yahoo.com.br, Espada, Mário C.^6,7,8,9 (AUTHOR) mario.espada@ese.ips.pt, Hernández-Beltrán, Víctor¹⁰ (AUTHOR) vhernandpw@alumnos.unex.es, Gamonales, José M.^10,11,12 (AUTHOR) martingamonales@unex.es, Pessôa Filho, Dalton M.^2,3 (AUTHOR) dalton.pessoa-filho@unesp.br

Publikováno v: Sensors (14248220). 3/15/2024, Vol. 24 Issue 6, p1-16. 16p. 2 Charts, 5 Graphs.

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