Výsledky vyhledávání

A Novel Flexible Thermoelectric Sensor for Intravascular Flow Assessment

Autor: Dennis van der Voort, B. Mimoun, Frans N. van de Vosse, Marcel C. M. Rutten, A Arjen van der Horst, Ronald Dekker

Publikováno v: Ieee Sensors Journal, 13(10), 3883-3891. IEEE
IEEE Sensors Journal, 13(10), 3883-3891. Institute of Electrical and Electronics Engineers

To accurately assess the severity of coronary artery disease, intracoronary pressure and flow measurements are required. In this paper, a novel flexible flow sensor, intended to be mounted on a medical guidewire, is tested experimentally. The device

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fd2ad8718848516780ba0774b8c09db7
https://doi.org/10.1109/jsen.2013.2252461

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Flex-to-Rigid (F2R): A Generic Platform for the Fabrication and Assembly of Flexible Sensors for Minimally Invasive Instruments

Autor: A Arjen van der Horst, B. Mimoun, Ronald Dekker, Vincent Adrianus Henneken

Publikováno v: IEEE Sensors Journal. 13:3873-3882

The flex-to-rigid (F2R) platform allows for the fabrication of miniature and flexible sensor assemblies for minimally invasive medical instruments such as catheters and guidewires. Devices fabricated on silicon wafers are transferred onto polyimide a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d200d9e5051541f03ba339dfae384838
https://doi.org/10.1109/jsen.2013.2252613

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Akademický článek

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A flexible ultra-thin-body SOI single-photon avalanche diode

Autor: Ryoichi Ishihara, Edoardo Charbon, Pengfei Sun, B. Mimoun

Publikováno v: 2013 IEEE International Electron Devices Meeting.

The world's first flexible ultra-thin-body SOI single-photon avalanche diode (SPAD) is reported with peak photon detection probability (PDP) at 11%, dark count rate (DCR) around 20kHz and negligible afterpulsing and cross-talk. It compares favorably

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::294fd783ec2d41fae65dbb029f338c4b
https://doi.org/10.1109/iedm.2013.6724606

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Geometric optimization of high performance interconnect of Rigid/Flexible/Rigid substrate for Wafer Level Packaging in Solid State Lighting applications by numerical simulations

Autor: H.W. van Zeijl, P. Liu, Guoqi Zhang, Robert Sokolovskij, J. Zhang, B. Mimoun

Publikováno v: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Wafer Level Packaging (WLP) technology for Solid State Lighting application is regarded as great potential for cost reduction. Rigid/Flexible/Rigid (RFR) substrate that is capable of transforming WLP devices from 2-dimentional into 3-dimentional devi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::81df02a31923c2f81cd960073071547a
https://doi.org/10.1109/eurosime.2013.6529982

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Living Chips and Chips for the living

Autor: B.J. van Meer, A. A. van der Horst, A. van de Stolpe, Angel Savov, Stefan R. Braam, Ronald Dekker, Marcus Cornelis Louwerse, S. Khoshfetrat Pakazad, B. Mimoun, Vincent Adrianus Henneken

Publikováno v: 2012 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM).

In this paper we present a “polymer-last” approach for the fabrication of (partly) flexible and stretchable sensors assemblies. The “Flex-to-Rigid” (F2R) platform is based on this approach and especially designed for the fabrication of very s

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8084599262b5d77c05a6ef0f9513fb02
https://doi.org/10.1109/bctm.2012.6352653

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Thermal flow sensors on flexible substrates for minimally invasive medical instruments

Autor: B. Mimoun, A. van der Horst, R. Dekker, D. van der Voort, M. Rutten, F. van de Vosse

Publikováno v: Proceedings of IEEE Sensors

We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After mea

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ca79cf9087cb86a74e9b18b1f7f7431e
https://research.tue.nl/nl/publications/42764b39-8818-4493-828d-bb0657003e0c

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Ultra-flexible devices for 360 μm diameter guidewires

Autor: Pasqualina M. Sarro, Ronald Dekker, B. Mimoun, Vincent Adrianus Henneken

Publikováno v: 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).

We report on the mechanical and electrical integrity of an ultra-flexible polyimide-based sensor platform for minimally invasive medical instruments. Aluminum structures placed in the stress neutral plane, the tensile plane or a combination of both a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2bd463740f9003fc8d8669315cee9c9e
https://doi.org/10.1109/memsys.2012.6170227

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