Zobrazeno 1 - 10
of 158
pro vyhledávání: '"B. Deva Prasad Raju"'
Publikováno v:
Arabian Journal of Chemistry, Vol 7, Iss 6, Pp 1099-1103 (2014)
The Pepper leaves extract acts as a reducing and capping agent in the formation of silver nanoparticles. A UV–Vis spectrum of the aqueous medium containing silver nanoparticles demonstrated a peak at 458 nm corresponding to the plasmon absorbance o
Externí odkaz:
https://doaj.org/article/ad5bb2836dc94ceca2408a8b7271a270
Autor:
K, Sunil Kumar, J, Pundareekam Goud, Ghanem, Mohamed A., B, Deva Prasad Raju, Gutturu, Rajasekhara Reddy, Joo, Sang Woo
Publikováno v:
In Ceramics International 15 September 2024 50(18) Part B:34270-34282
Autor:
K Sai Manogna, B Deva Prasad Raju, G Rajasekhara Reddy, Parashuram Kallem, Mannur Ismail Shaik, N John Sushma
Publikováno v:
Heliyon, Vol 10, Iss 3, Pp e25064- (2024)
Breast cancer remains a significant global health concern, necessitating the development of novel therapeutic approaches. In this study, we investigate the role of Eu3+ doped hydroxyapatite nanocomposites (Han: Eu3+) in the treatment of MCF7 and 4T1
Externí odkaz:
https://doaj.org/article/4cd17b5cb7864596b94148508db31419
Autor:
Gelija, Devarajulu, P., Reddi Babu, Kshetri, Yuwaraj K., Kim, Tae-Ho, B., Deva Prasad Raju, Kim, Moon-Deock, Chung, Woon Jin
Publikováno v:
In Materials Today Communications August 2023 36
Publikováno v:
In Materials Research Bulletin October 2021 142
Autor:
Devarajulu Gelija, B. Kiran Kumar, P. Reddi Babu, Yuwaraj K. Kshetri, Tae-Ho Kim, B. Deva Prasad Raju, Moon-Deock Kim
Publikováno v:
Ceramics International. 49:5872-5883
Autor:
P. Reddi Babu, Devarajulu Gelija, Kedhareswara Sairam Pasupuleti, B. Kiran Kumar, N. John Sushma, Moon‐Deock Kim, B. Deva Prasad Raju
Publikováno v:
Luminescence. 38:71-82
Autor:
G. Devarajulu, B. Kiran Kumar, P. Reddi Babu, M. Dhananjaya, Na-hyun Bak, Kedhareswara Sairam Pasupuleti, B. Deva Prasad Raju, Moon-Deock Kim
Publikováno v:
Ceramics International. 48:24550-24559
Publikováno v:
Materials Today: Proceedings.
Publikováno v:
AIP Conference Proceedings.