Zobrazeno 1 - 10
of 40
pro vyhledávání: '"B. C. Webb"'
Autor:
A. M. Stephens, P.S. Andry, R. Horton, Sri M. Sri-Jayantha, Steven L. Wright, Katsuyuki Sakuma, Cornelia K. Tsang, Mario J. Interrante, John U. Knickerbocker, B. C. Webb, Edmund J. Sprogis, Chirag S. Patel, R. Sirdeshmukh, Anna W. Topol, B. Dang, Robert J. Polastre
Publikováno v:
IBM Journal of Research and Development. 52:553-569
Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product benefits. Advantages of these emerging 3D silicon integration techn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab780d36783610051083c9e1bc75a6a1
https://doi.org/10.1147/jrd.2008.5388564
https://doi.org/10.1147/jrd.2008.5388564
Autor:
J. Zheng, B. C. Webb, Steven L. Wright, Katsuyuki Sakuma, Edmund J. Sprogis, B. Dang, Robert J. Polastre, John U. Knickerbocker, P.S. Andry, R. Horton, Chirag S. Patel, Mario J. Interrante, Cornelia K. Tsang, Arun Sharma
Publikováno v:
IBM Journal of Research and Development. 52:599-609
Three-dimensional (3D) integration technology promises to continue enhancing integrated-circuit system performance with high bandwidth, low latency, low power, and a small form factor for a variety of applications. In this work, conventional C4 (cont
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::054dc6eca183ceaa31cf7572a797c201
https://doi.org/10.1147/jrd.2008.5388560
https://doi.org/10.1147/jrd.2008.5388560
Autor:
Edmund J. Sprogis, Steven L. Wright, Katsuyuki Sakuma, R. Horton, J. Maria, P.S. Andry, Chirag S. Patel, John U. Knickerbocker, B. Dang, Robert J. Polastre, B. C. Webb, Cornelia K. Tsang, Sung K. Kang
Publikováno v:
IBM Journal of Research and Development. 52:611-622
Three-dimensional (3D) integration using through-silicon vias (TSVs) and low-volume lead-free solder interconnects allows the formation of high signal bandwidth, fine pitch, and short-distance interconnections in stacked dies. There are several appro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f54a5c5bd1d71523dd26df058541512
https://doi.org/10.1147/jrd.2008.5388567
https://doi.org/10.1147/jrd.2008.5388567
Autor:
B. C. Webb, Steven L. Wright, P.S. Andry, Dennis G. Manzer, Edmund J. Sprogis, B. Dang, Cornelia K. Tsang
Publikováno v:
IBM Journal of Research and Development. 52:571-581
As traditional CMOS scaling becomes progressively more difficult and less beneficial to overall system performance, three-dimensional silicon integration technologies have begun to receive considerable attention. An advanced packaging solution based
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3978384ff5967391acbf7d566d1b2d8e
https://doi.org/10.1147/jrd.2008.5388558
https://doi.org/10.1147/jrd.2008.5388558
Publikováno v:
Scopus-Elsevier
Treatment of oral candidosis with topical antifungal agents such as nystatin and amphotericin B is effective initially. However, medication can produce side effects in some patients and when therapy is stopped the condition can recur. Alternative tre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2b9e83f123c4fc37ad7f6ef88eb376c9
https://doi.org/10.1111/j.1834-7819.1998.tb00172.x
https://doi.org/10.1111/j.1834-7819.1998.tb00172.x
Publikováno v:
Australian Dental Journal. 43:160-166
Certain systemic conditions and/or defects in the immune system may predispose the host to oral candidal infection and the commonest form of oral candidosis is candida-associated denture stomatitis. Until recently there has been controversy concernin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8633641febdaacae96604470d929b611
https://doi.org/10.1111/j.1834-7819.1998.tb00157.x
https://doi.org/10.1111/j.1834-7819.1998.tb00157.x
Autor:
Adrian W. A. Rushton, B. C. Webb, R.A. Hughes, Anthony H. Cooper, Stewart G. Molyneux, R. M. Moore
Publikováno v:
Geological Magazine. 132:185-211
A new lithostratigraphy is presented for the Skiddaw Group (lower Ordovician) of the English Lake District. Two stratigraphical belts are described. Five formations are defined in the Northern Fells Belt, ranging in age from Tremadoc to early Llanvir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6bd41d9ec25911a79a466339411863c
https://doi.org/10.1017/s0016756800011742
https://doi.org/10.1017/s0016756800011742
Autor:
B. C. Webb, Xiaoxiong Gu, Michael R. Scheuermann, Zheng Xu, Kenneth Rose, John U. Knickerbocker, Jian-Qiang Lu
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
It is important to understand how to deliver power into 3D heterogeneous systems, which require different power supplies for different components (e.g., digital, analog, mixed-signal, MEMS parts). This paper reports on a study for a simplified case,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a862abd34bb9e1428c9b6f4833eac8e4
https://doi.org/10.1109/ectc.2012.6249085
https://doi.org/10.1109/ectc.2012.6249085
Autor:
Kenneth Rose, Xiaoxiong Gu, B. C. Webb, John U. Knickerbocker, Michael R. Scheuermann, Zheng Xu, Jian-Qiang Lu
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
While three-dimensional (3D) technology has several advantages for power delivery, an integrated chip-level, interposer-level, and package-level power distribution network in through-silicon-via (TSV)-based 3D system has to be modeled and evaluated.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae367354f2b0e07bc7a74357f97be794
https://doi.org/10.1109/ectc.2012.6248906
https://doi.org/10.1109/ectc.2012.6248906
Autor:
Christopher S. Putnam, Jian-Qiang Lu, Xiaoxiong Gu, John U. Knickerbocker, Michael R. Scheuermann, Zheng Xu, Kenneth Rose, B. C. Webb
Publikováno v:
2012 SEMI Advanced Semiconductor Manufacturing Conference.
Decoupling capacitors are essential to reduce high transient current noise and to provide a low impedance power delivery path. 3D technology has several advantages for power delivery, and this work investigates the impacts of decoupling capacitors on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac0b8ef3a75c3437ba8c791336515710
https://doi.org/10.1109/asmc.2012.6212938
https://doi.org/10.1109/asmc.2012.6212938