Zobrazeno 1 - 10
of 35
pro vyhledávání: '"B, Herrman"'
Publikováno v:
Theoretical and Applied Veterinary Medicine, Vol 11, Iss 2, Pp 3-8 (2023)
Searching for modern strategies to ensure productive parameters in the context of modern requirements for the relatively limited use of antibiotics as growth stimulants is relevant for the pig breeding industry. First and foremost, maintaining intest
Externí odkaz:
https://doaj.org/article/1fc3a3e38bb54ba89fb4a940590acd9c
Publikováno v:
IBM Journal of Research and Development. 49:823-836
This paper describes the electrical architecture and design of the IBM eServerTM BladeCenter® midplane and media interface card. The midplane provides the redundant interconnects among processor blades, switch modules, media interface card, and mana
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3bd3e9d08b98869c3b6abc3c41d6846
https://doi.org/10.1147/rd.496.0823
https://doi.org/10.1147/rd.496.0823
Publikováno v:
Physics of the Solid State. 45:656-661
The effect of temperature on the dynamic yield strength and ultimate tensile strength of high-purity and commercial-purity titanium and an α+β alloy Ti-6Al-2Sn-2Zr-2Cr-2Mo-Si upon submicrosecond-scale shock-wave loading was studied. An anomalous in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82fb299b49509c0b757817848e21196c
https://doi.org/10.1134/1.1569001
https://doi.org/10.1134/1.1569001
Autor:
F E, ADAIR, J B, HERRMAN
Publikováno v:
Surgery, gynecologyobstetrics. 83
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::0e97aa9ce95bb49326b3ebb355b7613d
https://pubmed.ncbi.nlm.nih.gov/20995817
https://pubmed.ncbi.nlm.nih.gov/20995817
Publikováno v:
General dentistry. 56(4)
When a tooth is extracted, the interproximal papilla recedes and the buccal bone collapses; as a result, restoring an edentulous space in the esthetic zone becomes a challenge. Various surgical reconstructions can be performed with different levels o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::860dac11c00e2dff1351062cc35924ac
https://pubmed.ncbi.nlm.nih.gov/19284191
https://pubmed.ncbi.nlm.nih.gov/19284191
Publikováno v:
2007 IEEE Electrical Performance of Electronic Packaging.
The goal of this paper is to describe some of the design choices made in a BladeCenter system design. This paper will focus on the connector modeling that was used to make design trade-offs, unique to a 10 Gbps serial system. Connectors are a signifi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5b6858eebe9398ce333a853a028542e
https://doi.org/10.1109/epep.2007.4387147
https://doi.org/10.1109/epep.2007.4387147
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
This paper describes the electrical architecture and design of the PCI express interface in the Blade Centertrade (J.E. Hughes et al., 2000) system. A comprehensive electrical design methodology, including accurate and detailed modeling and simulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1b51b0ef8a9e2f61807f386d704c5fc
https://doi.org/10.1109/ectc.2007.373820
https://doi.org/10.1109/ectc.2007.373820
Autor:
E. Matoglu, B. Herrman, Pravin Patel, Bhyrav M. Mutnury, Nam H. Pham, D.N. de Araujo, Moises Cases
Publikováno v:
56th Electronic Components and Technology Conference 2006.
This paper investigates the role of embedded capacitors in the enablement of future high speed digital systems. Present and future chip core and off-chip clock frequencies impose high demands on the design of the power and signal distribution systems
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3359d556ce56bc536769308490836a89
https://doi.org/10.1109/ectc.2006.1645883
https://doi.org/10.1109/ectc.2006.1645883
Publikováno v:
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..
The purpose of this paper is to describe BladeCenter/spl trade/ packaging technology and compare with 1U and 2U rack systems to illustrate the improvements. The power and thermal design challenges are described. The paper covers in detail power and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4195322f2865fc766b37e64d1c8d3e7e
https://doi.org/10.1109/epep.2005.1563737
https://doi.org/10.1109/epep.2005.1563737
Autor:
J. Hughes, Moises Cases, R. Mitra, D.N. de Araujo, R. Hashemi, Pravin Patel, E. Matoglu, Nam H. Pham, B. Herrman
Publikováno v:
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..
In this paper, we describe the challenges and design choices in a BladeCenter/spl trade/ environment and the modeling that was used to make the choices and trade-offs unique to the midplane product. The midplane in the BladeCenter system can be defin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84191da82b242ad8c088423c5e820908
https://doi.org/10.1109/epep.2005.1563729
https://doi.org/10.1109/epep.2005.1563729