Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Azwar Yunus"'
Autor:
Ramayanty Bulan, Mustaqimah, Nunik Destria Arianti, Azwar Yunus, Akhyar Ibrahim, Agustami Sitorus
Publikováno v:
Results in Engineering, Vol 19, Iss , Pp 101331- (2023)
The chopper's performance is affected by the moisture content level of the material being chopped and the speed of the machine's rotation. This research aims to develop a chopper for an areca nut frond with performance optimization using RSM. RSM was
Externí odkaz:
https://doaj.org/article/805ef7f688204248b1523f24a44ff6c4
Autor:
Azwar Yunus
Publikováno v:
Jurnal POLIMESIN. 9:847
Korosi adalah proses pengrusakan logam akibat reaksi elektrokimia antara logam dengan lingkungannya. Proses korosi terjadi secara alamiah yaitu logam kembali bersenyawa dengan oksigen sebagaimana bahan baku (ores) pada proses ekstraksi metalurgi pemb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25d16a3c6cb2a8fc8ca4d562474c37a0
https://doi.org/10.30811/jpl.v9i1.1
https://doi.org/10.30811/jpl.v9i1.1
Autor:
Saifuddin, Azwar Yunus
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 536:012021
During each processing step of multicrystalline (mc) silicon solar cells production, it requires a good mechanical stability to avoid cell breakage. Therefore, wafers and cells with a good mechanical stability are absolutely important. The cracking o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f70ab5380fea5c455c121c1f825ec9df
https://doi.org/10.1088/1757-899x/536/1/012021
https://doi.org/10.1088/1757-899x/536/1/012021
Publikováno v:
Solar Energy Materials and Solar Cells. 95:97-100
Silicon wafer thickness reduction without increasing the wafer strength leads to a high breakage rate during subsequent handling and processing steps. Cracking of solar cells has become one of the major sources of solar module failure and rejection.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98ccd49855bbe6a05e5486061dd2887d
https://doi.org/10.1016/j.solmat.2010.04.038
https://doi.org/10.1016/j.solmat.2010.04.038
Publikováno v:
2010 35th IEEE Photovoltaic Specialists Conference.
Silicon wafer thickness reduction without increasing the wafer strength leads to a high breakage rate during subsequent handling and processing steps. Cracking of solar cells has become one of the major sources of solar module failure and rejection.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8bc7f9ec9866aa3a8d51422fbaa76623
https://doi.org/10.1109/pvsc.2010.5616046
https://doi.org/10.1109/pvsc.2010.5616046
Publikováno v:
Lex Localis: Journal of Local Self-Government; Oct2024, Vol. 22 Issue 4, p104-123, 20p
Autor:
Azwar Yunus, Saifuddin
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Jun2019, Vol. 536 Issue 1, p1-1, 1p
Publikováno v:
Malaysia Journal Syariah & Law; Dec2023, Vol. 11 Issue 2, p310-329, 20p