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Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Anhydride hardener molding compound has been widely accepted as an encapsulation technology for high voltage application products. The roles of encapsulation materials extend beyond just encapsulating the device; these materials also provide heat dis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83e7614d028d39ba99a9c2f9518fa8c6
https://doi.org/10.1109/iemt.2008.5507843
https://doi.org/10.1109/iemt.2008.5507843
