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Akademický článek

Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)

Autor: Jumpei KUSUYAMA, Ayumu HONDA, Shintaro IWAHASHI, Takayuki KITAJIMA, Akinori YUI, Toshihiro ITO, Xiaodong LU, Alexander H. SLOCUM

Publikováno v: Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 852, Pp 17-00102-17-00102 (2017)

Si wafer diameter tends to be increased from 300 mm to 450 mm in order to increase semiconductor device productivity. To this end, the authors developed a rotary grinding machine with high stiffness, equipped with water hydrostatic bearings. This gri

Externí odkaz: https://doaj.org/article/110200f9544746f494924e211bc75d0b

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Akademický článek

Development of rotary table grinding machine for large diameter Si wafers (1st report: Performance investigation of water hydrostatic rotary table)

Autor: Jumpei KUSUYAMA, Ayumu HONDA, Takayuki KITAJIMA, Go OKAHATA, Akinori YUI, Toshihiro ITO, A. H. SLOCUM

Publikováno v: Nihon Kikai Gakkai ronbunshu, Vol 82, Iss 842, Pp 16-00190-16-00190 (2016)

Increasing of Si wafer diameter from φ300 mm to φ450 mm is required to enhance productivity of semiconductor devices. The authors developed a high stiff rotary grinding machine, which consists of a rotary table system and a wheel spindle system. Th

Externí odkaz: https://doaj.org/article/6e8c8212acd3456f96963fec94eddea6

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B28 Development of Grinding Machine for 450mm Wafer : Fundamental Performance of Wheel Spindle which creates both rotary and axial feed motion

Autor: Akinori Yui, Takayuki Kitajima, Shintaro Iwahashi, Alexander H. Slocum, Ayumu Honda, Hirotsugu Saito, Jumpei Kusuyama

Publikováno v: The Proceedings of The Manufacturing & Machine Tool Conference. :109-110

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8f60223edf6573bb42c2a4e283bcbb6a
https://doi.org/10.1299/jsmemmt.2014.10.109

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S1310101 Development of Rotary Grinding Machine for 450mm Si Wafer : Positioning accuracy of wheel spindle which creates both rotary and axial feed motions

Autor: Jumpei Kusuyama, Alexander H. Slocum, Akinori Yui, Shintaro Iwahashi, Takayuki Kitajima, Hirotsugu Saito, Ayumu Honda

Publikováno v: The Proceedings of Mechanical Engineering Congress, Japan. 2015:S1310101

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::51108028d2e026b578a3ab4246cb8832
https://doi.org/10.1299/jsmemecj.2015._s1310101-

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A11 Development of Grinding Machine for 450mm Wafer : 1^ report: Specification and Fundamental Performance of The Grinding Machine

Autor: Go Okahata, Akinori Yui, Shigeki Okuyama, Tomoyuki Koiwai, Takayuki Kitajima, Ayumu Honda, Hisashi Kobayashi

Publikováno v: The Proceedings of The Manufacturing & Machine Tool Conference. :31-32

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1d3de2abae575cd53c2c2da835e3974f
https://doi.org/10.1299/jsmemmt.2012.9.31

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A12 Development of Grinding Machine for 450mm Wafer : 2^ Report:Numerical Analysis of Static Stiffness and Load Capacity of Water Hydrostatic Table

Autor: Tomoyuki Koiwai, Ayumu Honda, Takayuki Kitajima, Go Okahata, Hisashi Kobayashi, Akinori Yui, Shigeki Okuyama

Publikováno v: The Proceedings of The Manufacturing & Machine Tool Conference. :33-34

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::955b11e5c0a64bb814bf9bf4b7f5a101
https://doi.org/10.1299/jsmemmt.2012.9.33

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