Zobrazeno 1 - 6 of 6 pro vyhledávání: '"Ayumu HONDA"'
1
Akademický článek
Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)
Autor: Jumpei KUSUYAMA, Ayumu HONDA, Shintaro IWAHASHI, Takayuki KITAJIMA, Akinori YUI, Toshihiro ITO, Xiaodong LU, Alexander H. SLOCUM
Publikováno v: Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 852, Pp 17-00102-17-00102 (2017)
Si wafer diameter tends to be increased from 300 mm to 450 mm in order to increase semiconductor device productivity. To this end, the authors developed a rotary grinding machine with high stiffness, equipped with water hydrostatic bearings. This gri
Externí odkaz: https://doaj.org/article/110200f9544746f494924e211bc75d0b
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2
Akademický článek
Development of rotary table grinding machine for large diameter Si wafers (1st report: Performance investigation of water hydrostatic rotary table)
Autor: Jumpei KUSUYAMA, Ayumu HONDA, Takayuki KITAJIMA, Go OKAHATA, Akinori YUI, Toshihiro ITO, A. H. SLOCUM
Publikováno v: Nihon Kikai Gakkai ronbunshu, Vol 82, Iss 842, Pp 16-00190-16-00190 (2016)
Increasing of Si wafer diameter from φ300 mm to φ450 mm is required to enhance productivity of semiconductor devices. The authors developed a high stiff rotary grinding machine, which consists of a rotary table system and a wheel spindle system. Th
Externí odkaz: https://doaj.org/article/6e8c8212acd3456f96963fec94eddea6
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