Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Ayda Halouani"'
Publikováno v:
Microsystem Technologies. 26:3011-3021
Thermo mechanical fatigue and damage have been always an issue for solder joint materials used in microelectronics. Accurate damage and crack prediction is important to define the life cycle of these joints. This paper provides a finite element model
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science. 234:4277-4287
An experimental investigation and numerical modeling using multiphysics finite element method were performed to study the thermal failure mechanism of low-profile quad flat package solder joints of memory module due to low-cycle fatigue. The strain,
Publikováno v:
Microelectronics Reliability. 138:114635
Publikováno v:
EuroSimE 2019-20th International Conference in Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems
EuroSimE 2019-20th International Conference in Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems, Mar 2019, Hannover, Germany. pp.1-6
EuroSimE 2019-20th International Conference in Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems, Mar 2019, Hannover, Germany. pp.1-6
In this paper, we propose a metamodel called generalized polynomial chaos (gPC) to investigate the stochastic response of a ball grid array (PBGA) package under thermal cycle excitation. The shear strain is extracted in the presence of uncertain mate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::127c25d2f6ac56c9de96eff64606b1d9
https://hal-utt.archives-ouvertes.fr/hal-02278339
https://hal-utt.archives-ouvertes.fr/hal-02278339
Publikováno v:
Advances in Acoustics and Vibration II
Advances in Acoustics and Vibration II, Mar 2018, Hammamet, Tunisia. pp.149-154
Applied Condition Monitoring ISBN: 9783319946153
Advances in Acoustics and Vibration II, Mar 2018, Hammamet, Tunisia. pp.149-154
Applied Condition Monitoring ISBN: 9783319946153
International audience; The plastic ball grid array (PBGA) package has become a major packaging type in recent years, due to its high capacity for the input/output counts. However, vibration loading is encountered during the service life of PBGA. Thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f8a45b6730ab2b101dac6de03d06268c
https://hal-utt.archives-ouvertes.fr/hal-02280428
https://hal-utt.archives-ouvertes.fr/hal-02280428