Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Ayako Sugaya"'
Publikováno v:
Japanese Journal of Applied Physics. 43:7419-7426
Detecting the position of wafers after chemical mechanical polishing (CMP) is a critical issue in current and forthcoming IC manufacturing. A wafer alignment system must be highly accurate for all processes. To satisfy such requirements, we have stud
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc793eb64a4f40aa962bdef9e94732be
https://doi.org/10.1143/jjap.43.7419
https://doi.org/10.1143/jjap.43.7419
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XVIII.
Advanced scanners need an extremely high accuracy wafer alignment system, and nowadays it is also necessary that the alignment marks occupy a smaller area in order to expand the available area for IC patterns. Therefore, narrower lines with a smaller
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9b4680c881557185876108da61b125a
https://doi.org/10.1117/12.535083
https://doi.org/10.1117/12.535083
Autor:
Ayako Sugaya
Publikováno v:
Digest of Papers Microprocesses and Nanotechnology 2003. 2003 International Microprocesses and Nanotechnology Conference.
In the progress of ULSI, alignment technology must have a high accuracy in all processes, even if the alignment mark is asymmetric and/or with a low step height. To satisfy such requirements, the alignment measurement errors and the pattern shape are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1e00965a5cf63994925bbfa191593196
https://doi.org/10.1109/imnc.2003.1268770
https://doi.org/10.1109/imnc.2003.1268770
Publikováno v:
Digest of Papers. 2004 International Microprocesses and Nanotechnology Conference, 2004..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8142249ed56fed4966510445d846fa6
https://doi.org/10.1109/imnc.2004.245734
https://doi.org/10.1109/imnc.2004.245734
Publikováno v:
SPIE Proceedings.
Advanced stepper or scanner needs extremely high accuracy alignment system. This alignment accuracy is mainly affected by the errors caused by mark deformations and by optical system. To improve the alignment accuracy of our wafer alignment system ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::117d73f0066cecf2bdffdd8f37b23282
https://doi.org/10.1117/12.483513
https://doi.org/10.1117/12.483513
Publikováno v:
SPIE Proceedings.
Detecting position of the wafers such as after CMP process is critical theme of current and forthcoming IC manufacturing. The alignment system must be with high accuracy for any process. To satisfy such requirements, we have studied and analyzed fact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::445f9dd112549a046a96590be7f8f0d0
https://doi.org/10.1117/12.474475
https://doi.org/10.1117/12.474475
Publikováno v:
SPIE Proceedings.
The faculties of current alignment sensors for CMP processes are studied. The alignment sensors are LSA, LIA and FIA, and all of them are currently equipped on Nikon's NSR series. The results showed that those sensors have enough faculties for presen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0967dc9d0710d05393e2d88e80da132e
https://doi.org/10.1117/12.276003
https://doi.org/10.1117/12.276003
Autor:
Satoru Odate, Tetsuya Koike, Katsumi Sugisaki, Ayako Sugaya, Chiaki Koike, Katsura Otaki, Kiyoshi Uchikawa, Hidemitsu Toba
Publikováno v:
Optics Express. 19:14268
Nyquist sampling theorem in an image calculation with angular spectrum method restricts a propagation distance and a focal length of a lens. In order to avoid these restrictions, we studied suitable expressions for the image computations depending on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a2277589913b999cf58779fb77d0ef6f
https://doi.org/10.1364/oe.19.014268
https://doi.org/10.1364/oe.19.014268
Autor:
Yucong Zhu, Katsumi Sugisaki, Satoru Odate, Ayako Sugaya, Chiaki Koike, Katsura Otaki, Tetsuya Koike, Kiyoshi Uchikawa
Publikováno v:
Applied Optics. 50:2815
We propose a design method of phase-analysis algorithms based on two-dimensional grating phase shifting for Talbot interferometry, Talbot-Lau imaging, or the Ronchi test. These algorithms are designed to separate the two orthogonal shearing wavefront
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c0b89a4ee852f6523f8517aee589fa5b
https://doi.org/10.1364/ao.50.002815
https://doi.org/10.1364/ao.50.002815
Autor:
Ayako Sugaya
Publikováno v:
Japanese Journal of Applied Physics. 44:5970
In LSI mass production, an alignment sensor must be installed in an exposure system to detect the pattern position accurately even if the pattern condition is changed. To satisfy such a requirement, the defocus effect of improving the image contrast
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c565e62c43ce1588dc1e0b0c978432fa
https://doi.org/10.1143/jjap.44.5970
https://doi.org/10.1143/jjap.44.5970