Zobrazeno 1 - 10
of 406
pro vyhledávání: '"Avram Bar-Cohen"'
Publikováno v:
Applied Sciences, Vol 11, Iss 22, p 11071 (2021)
This study experimentally explores the thermofluidic performance of a cryogenic micro-pin fin cooler with two-phase liquid nitrogen flows. The liquid nitrogen cooling system is introduced to investigate the performance of the micro-pin cooler in a cr
Externí odkaz:
https://doaj.org/article/6b49d05f324f4c3f9f8fdc083e8235c5
Autor:
Gary Bulman, Phil Barletta, Jay Lewis, Nicholas Baldasaro, Michael Manno, Avram Bar-Cohen, Bao Yang
Publikováno v:
Nature Communications, Vol 7, Iss 1, Pp 1-7 (2016)
Current thermoelectric modules provide cooling fluxes that are insufficient for high-heat flux applications. Here, the authors demonstrate thin-film-based thermoelectric modules capable of providing cooling fluxes more than double that of the current
Externí odkaz:
https://doaj.org/article/7ef66516ffcd432f9678982c76251606
Autor:
Subramanian S. Iyer, Michael T. Barako, Avram Bar-Cohen, Timothy S. Fisher, Matthew Ma, Ujash Shah
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1604-1614
This work demonstrates transient cooling for high-heat-flux electronics using pressure-controlled flash boiling. Many advanced electronics packages demand rapid, high-heat flux removal under stringent spatial and temporal constraints such as limited
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f605c669c4ef2079d81dc125493e45c
https://doi.org/10.1109/tcpmt.2021.3085876
https://doi.org/10.1109/tcpmt.2021.3085876
Autor:
Michael M. Ohadi, Raphael Mandel, Mehdi Asheghi, Catherine Gorle, Suresh V. Garimella, Mark D. Schultz, Justin A. Weibel, Pritish R. Parida, Joel L. Plawsky, Timothy J. Chainer, James W. Palko, Kenneth E. Goodson, Joseph J. Maurer, Avram Bar-Cohen, Yoav Peles, Yogendra Joshi
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1546-1564
The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram Bar-Cohen during 2012–2015 to target an order of magnitude improvement in chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ce082155cb428be85ef980b46ec7b54
https://doi.org/10.1109/tcpmt.2021.3111114
https://doi.org/10.1109/tcpmt.2021.3111114
Autor:
Muhannad S. Bakir, Suresh K. Sitaraman, Avram Bar-Cohen, Jeffrey C. Suhling, Andrew A. O. Tay
Publikováno v:
Encyclopedia of Packaging Materials, Processes, and Mechanics. :i-xii
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39afe2e72d9b5a41d1d79b5f002cc511
https://doi.org/10.1142/9789811209673_fmatter
https://doi.org/10.1142/9789811209673_fmatter
Publikováno v:
Applied Physics B. 127
This study investigates the thermal performance of cryogenic micro-pin fin coolers for high-power laser diode (LD) bars. An open-loop liquid nitrogen cooling system, used to operate LD bars at cryogenic temperatures, is developed and characterized. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08f55ca57d5cad450c0edbd40e6f86e2
https://doi.org/10.1007/s00340-021-07590-0
https://doi.org/10.1007/s00340-021-07590-0
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Two-phase embedded cooling has great potential for meeting the increasing thermal management needs of high-heat flux electronics. The use of manifold-microchannels further enhances the effectiveness of embedded cooling while maintaining low pressure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13cb37e124d72cb38f7cafe3d9fffe1b
https://doi.org/10.1109/itherm45881.2020.9190239
https://doi.org/10.1109/itherm45881.2020.9190239
Autor:
Philip Barletta, Bao Yang, Zhi Yang, Nicholas G. Baldasaro, Avram Bar-Cohen, Sevket U. Yuruker, Michael Fish
Publikováno v:
Frontiers in Energy. 12:109-120
The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency. Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97ac8a9e7304524128d8320b6c004c47
https://doi.org/10.1007/s11708-018-0540-8
https://doi.org/10.1007/s11708-018-0540-8
Publikováno v:
International Journal of Heat and Mass Transfer. 115:530-536
Transistor heat generation in wide bandgap power amplifier transistors is today in excess of several kW/cm 2 and can result in temperature spikes, or “hotspots,” approaching 100 K in the near-junction region. Novel, high flux cooling techniques a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd2cd446dba296d90ece8c4220f7a526
https://doi.org/10.1016/j.ijheatmasstransfer.2017.07.081
https://doi.org/10.1016/j.ijheatmasstransfer.2017.07.081
Publikováno v:
Applied Sciences, Vol 11, Iss 11071, p 11071 (2021)
Applied Sciences; Volume 11; Issue 22; Pages: 11071
Applied Sciences; Volume 11; Issue 22; Pages: 11071
This study experimentally explores the thermofluidic performance of a cryogenic micro-pin fin cooler with two-phase liquid nitrogen flows. The liquid nitrogen cooling system is introduced to investigate the performance of the micro-pin cooler in a cr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::36401cb0403ce7f49e26a46175b63e33
https://doi.org/10.3390/app112211071
https://doi.org/10.3390/app112211071