Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Avin V"'
Publikováno v:
Cureus. 14(6)
Background The novel coronavirus disease 2019 (COVID-19) was declared a pandemic that had affected 224 countries, causing2.1 million deaths worldwide. The association of the different ABO blood groups with the risk and severity of COVID-19 infections
Autor:
Mahesh Eswarappa, Saritha Suryadevara, Rajashekar R, Mahesh Kumar K B, Gurudev K C, Puru Tyagi, Avin V
Publikováno v:
Cureus. 14(4)
Diabetic kidney disease (DKD) is the commonest cause of chronic kidney disease and end-stage kidney disease worldwide, consequently it has become an important productive implication to the healthcare system. This study was conducted to assess the pre
Autor:
David D. Fleming, Anupam Choubey, Avin V. Dhoble, Jeffrey M. Calvert, Joon-Seok Oh, Edgardo Anzures, Robert K. Barr
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:1-28
There has been significant activity in recent years to develop Non-Conductive Films (NCF), which are also known as Pre-Applied Underfills (PAUF) and Wafer Level Underfills (WLUF), for use in the High Volume Manufacturing (HVM) of 2.5D and 3D packages
Autor:
I. Lee, Anupam Choubey, J. Woertink, Y. Qin, David D. Fleming, Mike Gallagher, Mark S. Oliver, Avin V. Dhoble, Edgardo Anzures, Zidong Wang, C. Truong
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001432-001451
Current demands of the industry on performance and cost has triggered the electronics industry to use high I/O counts semiconductor packages. Copper pillar technology has been widely adopted for introducing high I/O counts in Flip Chip and 3D Chip St