Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Austin M. Cano"'
Publikováno v:
Chemistry of Materials. 34:6440-6449
Publikováno v:
The Journal of Physical Chemistry C. 126:6990-6999
Autor:
Simon D. Elliott, Jonathan L. Partridge, Austin M. Cano, Suresh Kondati Natarajan, Steven M. George
Publikováno v:
The Journal of Physical Chemistry C. 125:25589-25599
Autor:
Austin M. Cano, Suresh Kondati Natarajan, Jonathan L. Partridge, Simon D. Elliott, Steven M. George
Funding Information: The FTIR studies were funded by Intel through a member specific research grant through the Semiconductor Research Corporation (SRC). Support for the new QMS reactor and the QMS investigations was provided by Lam Research. S.K.N.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::03145bdf4a40e03db33adf0630f4230c
https://aaltodoc.aalto.fi/handle/123456789/113898
https://aaltodoc.aalto.fi/handle/123456789/113898
Autor:
Jonas C. Gertsch, Jonathan L. Partridge, Austin M. Cano, Joel W. Clancey, Victor M. Bright, Steven M. George
Publikováno v:
Journal of Vacuum Science & Technology A. 41:012603
The thermal atomic layer etching (ALE) of VO2 was demonstrated using sequential exposures of BCl3 and SF4. The VO2 etch rate measured by quartz crystal microbalance investigations at 250 °C was 2.3 Å/cycle. The mass losses during individual BCl3 an
Publikováno v:
Chemistry of Materials. 31:3624-3635
Thermal atomic layer etching (ALE) is an important technique for the precise isotropic etching of nanostructures. Thermal ALE of many materials can be achieved using a two-step fluorination and lig...
Publikováno v:
The Journal of Physical Chemistry C. 123:10346-10355
Thermal Al2O3 atomic layer etching (ALE) can be accomplished using sequential fluorination and ligand-exchange reactions. HF can be employed as the fluorination reactant, and Al(CH3)3 can be utilized as the metal precursor for ligand exchange. This s
Publikováno v:
ACS Applied Materials & Interfaces. 9:10296-10307
The thermal atomic layer etching (ALE) of SiO2 was performed using sequential reactions of trimethylaluminum (TMA) and hydrogen fluoride (HF) at 300 °C. Ex situ X-ray reflectivity (XRR) measurements revealed that the etch rate during SiO2 ALE was de
Publikováno v:
Journal of Vacuum Science & Technology A. 39:021001
Atomic layer processing such as atomic layer deposition (ALD) and thermal atomic layer etching (ALE) is usually described in terms of sequential, self-limiting surface reactions. This picture for ALD and thermal ALE leaves out the possibility that th
Publikováno v:
ACS applied materialsinterfaces. 9(11)
The thermal atomic layer etching (ALE) of SiO