Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Augustin J. Hong"'
Publikováno v:
Advanced Materials. 24:1899-1902
The viability of single-walled carbon nanotubes (SWCNTs) as a transparent conducting electrode on a-Si:H based single junction solar cells was explored. A Schottky barrier formed at a SWCNT/a-Si:H interface was removed by introducing high work functi
Publikováno v:
Journal of Microelectromechanical Systems. 21:235-242
This paper presents a microscale resonant sensor that has been fabricated with nanoscale pores for enhanced sensitivity to chemical vapors. By building resonators that are made of porous silicon, we take advantage of the increased area for molecular
Autor:
Emil B. Song, Kang L. Wang, Bruce H. Weiller, Yong Wang, Matthew J. Allen, Jonathan K. Wassei, Young-Ju Park, Jin Zou, Jesse D. Fowler, Jiyoung Kim, Hyung Suk Yu, Richard B. Kaner, Augustin J. Hong
Publikováno v:
ACS Nano. 5:7812-7817
Graphene's single atomic layer of sp(2) carbon has recently garnered much attention for its potential use in electronic applications. Here, we report a memory application for graphene, which we call graphene flash memory (GFM). GFM has the potential
Autor:
Chi-Chun Liu, Augustin J. Hong, Jin Zou, Faxian Xiu, Yong Wang, Kang L. Wang, Shengxiang Ji, Jiyoung Kim, Paul F. Nealey
Publikováno v:
Nano Letters. 10:224-229
As information technology demands for larger capability in data storage continue, ultrahigh bit density memory devices have been extensively investigated. To produce an ultrahigh bit density memory device, multilevel cell operations that require seve
Autor:
Robin Chao, Judson R. Holt, Augustin J. Hong, David Conklin, Anita Madan, Todd Bailey, Kriti Kohli, Yunlin Zhang, G. Raja Muthinti
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXVIII.
Integrated circuits from 22nm node and beyond utilize many innovative techniques to achieve features that are well beyond the resolution limit of 193nm immersion lithography. The introduction of complex 3D structures in device design presents additio
Autor:
Devendra K. Sadana, Corsin Battaglia, Christophe Ballif, Jeehwan Kim, Woo-Shik Jung, Mathieu Charrière, Hongsik Park, Augustin J. Hong
Publikováno v:
Advanced materials (Deerfield Beach, Fla.). 26(24)
High aspect-ratio three-dimensional (3D) a-Si:H solar cells have been fabricated to enhance a light absorption path while maintaining a short carrier collection length. Substantial efficiency enhancement in 3D solar cells was achieved due to the boos
Autor:
Jeehwan Kim, Frances M. Ross, Byungha Shin, Jae-Woong Nah, Augustin J. Hong, Devendra K. Sadana
Publikováno v:
ACS nano. 6(1)
We introduce a cost-effective method of forming size-tunable arrays of nanocones to act as a three-dimensional (3D) substrate for hydrogenated amorphous silicon (a-Si:H) solar cells. The method is based on self-assembled tin nanospheres with sizes in
Autor:
Kyeong-Sik Shin, Kang L. Wang, Sung-min Kim, Joo Tae Moon, Yongha Hwang, Jiyoung Kim, Rob N. Candler, Faxian Xiu, Kosmas Galatsis, Chi On Chui, Augustin J. Hong, Emil B. Song, Si-Young Choi
Publikováno v:
Nanotechnology. 22(25)
We have demonstrated, for the first time, a novel three-dimensional (3D) memory chip architecture of stacked-memory-devices-on-logic (SMOL) achieving up to 95% of cell-area efficiency by directly building up memory devices on top of front-end CMOS de
Autor:
Jiyoung Kim, Augustin J. Hong, K.L. Wang, Alexander Khitun, Ajey Poovannummoottil Jacob, Mingqiang Bao
Publikováno v:
2008 Device Research Conference.
The authors analyze the performance and estimate the efficiency of the spin-wave based logic devices. The main potential advantage of using spin wave for information transmission and processing is that a bit of information can be transmitted without
Autor:
K.L. Wang, Emil B. Song, Jeong-hee Han, U-In Chung, Siguang Ma, You-Sheng Lin, Augustin J. Hong, M. Ogawa, Jiyoung Kim
Publikováno v:
2008 Symposium on VLSI Technology.
A 3-D flash memory cell of VRAT (vertical-recess-array-transistor) has been fabricated using a unique and simple 3-D integration method of PIPE (planarized integration on the same plane), which allows for the successful implementation of ultra high d