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Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this article, the polyimide formation at high pressure for advanced assembly technology is reported for the first time. Polyimides are formed in a pneumatic oven for evaluation of voids and cycle times. For comparison and production evaluation, th