FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact

Autor: Auersperg, Jürgen, Breuer, D., Machani, K.V., Rzepka, Sven, Michel, Bernd

Publikováno v: AMC 2015 – Advanced Metallization Conference

With the recent increase in Gold (Au) wire cost Copper (Cu) wire becomes an attractive way to manage overall package cost. On the other hand, Copper wire bonding introduces much higher mechanical impact to underlying BEoL structures and actives becau

Externí odkaz: https://monarch.qucosa.de/id/qucosa%3A20518
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List of contributors

Autor: Aalto, Timo, Airaksinen, Veli-Matti, Albert, Stephan Gerhard, Allegato, Giorgio, Amiotti, Marco, Anttila, Olli, Auersperg, Juergen, Bonucci, Antonio, Bose, Indranil Ronnie, Braun, Tanja, Broas, Mikael, Burggraf, J., Cameron, Christopher, Candler, Rob N., Cao, Zhen, Cardoso, André, Chen, Kuo-Shen, Conte, Andrea, Cozma, Adriana, Davis, Cristina E., Dempwolf, Sophia, Dixit, Pradeep, Dost, Michael, Dragoi, Viorel, Eränen, Simo, Fain, Bruno, Figeys, B., Fischer, Andreas C., Flötgen, Christoph, Franssila, Sami, Friedberger, Alois, Fueldner, Marc, Ganchenkova, Maria, Gonzalez, Pilar, Gosálvez, Miguel A., Grimes, Michael, Haapalinna, Atte, Hagelin, Paul, Hammond, Paul, Henttinen, Kimmo, Henttonen, Vesa, Horsley, David, Hoshi, Takeo, Itoh, Satoshi, Jakobsen, Henrik, Jansen, R., Jonsson, Kerstin, Kähler, Dirk, Kannojia, Harindra Kumar, Kattelus, Hannu, Kissinger, Gudrun, Knechtel, Roy, Knese, Kathrin, Kolari, Kai, Koskenvuori, Mika, Kuisma, Heikki, Kulkarni, Amit, Laermer, Franz, Landesberger, Christof, Leinenbach, Christina, LeVasseur, Michael K., Li, Jue, Lin, Yuyuan, Lindner, Paul F., Lodewijks, K., Lofink, Fabian, Longoni, Giorgio, Luber, Sebastian Markus, Mahmud-ul-hasan, M., Mäkinen, Jari, Mäntysalo, Matti, Martin, Devin, Maspero, Federico, Mattila, Toni T., Mauri, Luca, Merz, Peter, Meyer, Doug, Moraja, Marco, Motooka, Teruaki, Müller, Gerhard, Muralt, Paul, Nieminen, Risto M., Niklaus, Frank, Oggioni, Laura, Olkkonen, Juuso, Österlund, Elmeri, Ou, Kuang-Shun, Paloheimo, Jari, Pasanen, Toni P., Paulasto-Kröckel, Mervi, Plach, Thomas, Polizzi, Jean-Philippe, Pressel, Klaus, Putkonen, Matti, Puurunen, Riikka L., Reinert, Wolfgang, Rizzi, Enea, Rochus, V., Ross, Glenn, Rottenberg, X., Sainiemi, Lauri, Savin, Hele, Schenk, Harald, Schikowski, Marc, Schulze, Matthias, Seema, S., Severi, S., Skogström, Lasse, Suga, Tadatomo, Sullivan, Scott, Suni, Tommi, Theuss, Horst, Tilli, Markku, Tilmans, H.A.C., Tittonen, Ilkka, Tofteberg, Hannah, Törmä, Pekka, Tuomikoski, Santeri, Tyholdt, Frode, Uda, Tsuyoshi, Vallin, Örjan, Valzasina, Carlo, Veijola, Timo, Viinikka, Eeva, Vogel, Dietmar, Vogl, Andreas, Vuorinen, Vesa, Westervelde, W.J., Wicht, Sebastian, Wieland, Robert, Winkler, Bernhard, Yobas, Levent, Zanotti, Luca, Zubel, I.

Publikováno v: In Handbook of Silicon Based MEMS Materials and Technologies Edition: Third Edition. 2020:xv-xvii

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