Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Atsushi Harikai"'
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Recently many issues have arisen when using conventional dicing methods. Such conventional methods are mechanical sawing (blade dicing) or laser dicing. Relevant applications of these methods are thin wafers, brittle materials and wafer singulation f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fed326b9e4cb6423f6fcdb8dcdb202da
https://doi.org/10.1109/estc.2018.8546486
https://doi.org/10.1109/estc.2018.8546486
Publikováno v:
Scopus-Elsevier
Reduction of cluster amount in silane discharges is the key to decreasing microstructure parameter Rα of a-Si:H films deposited with the discharges. The cluster amount is found to be reduced more than one order of magnitude using 60 MHz discharges i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0b0997e095365be8616d83c2c938e8c8
http://www.scopus.com/inward/record.url?eid=2-s2.0-1642459373&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-1642459373&partnerID=MN8TOARS
