Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Atsuko Takita"'
Publikováno v:
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 38:429-437
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7cf7d0225eda5ef8d35b55a3d8f2976
https://doi.org/10.2207/qjjws.38.429
https://doi.org/10.2207/qjjws.38.429
Publikováno v:
The Proceedings of the Materials and Mechanics Conference. 2022:SS0104
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b18446505c7eff3bf0c4906a0c07461c
https://doi.org/10.1299/jsmemm.2022.ss0104
https://doi.org/10.1299/jsmemm.2022.ss0104
Publikováno v:
The Proceedings of the Materials and Mechanics Conference. 2022:SS0103
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8878e8404cf36ac04ba35269cc6ddeb
https://doi.org/10.1299/jsmemm.2022.ss0103
https://doi.org/10.1299/jsmemm.2022.ss0103
Publikováno v:
The Proceedings of the Materials and Mechanics Conference. 2022:SS0106
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c8b389639932489fbf3f55e628f3b55
https://doi.org/10.1299/jsmemm.2022.ss0106
https://doi.org/10.1299/jsmemm.2022.ss0106
Publikováno v:
Key Engineering Materials. 734:251-259
In design of the electronic device, FEM analyses considering the creep deformation of solder joints in-situ should be conducted to evaluate the strength reliability. The indentation test is one of effective method to evaluate the creep deformation in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fb3cd9467cc66a77088c3cbd0bdf015
https://doi.org/10.4028/www.scientific.net/kem.734.251
https://doi.org/10.4028/www.scientific.net/kem.734.251
Publikováno v:
Key Engineering Materials. 725:293-298
For accurate evaluation of the reliability of electronic package, FEM analyses considering the creep deformation of solder joint in-situ should be conducted. It is well known that the indentation creep test has an advantage to evaluate the creep defo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db8a51ae3ae17d76fe2469b03b739041
https://doi.org/10.4028/www.scientific.net/kem.725.293
https://doi.org/10.4028/www.scientific.net/kem.725.293
Publikováno v:
The Proceedings of Mechanical Engineering Congress, Japan. 2020:J03117
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6ad2845de2170f54eb6c6976f433ab8
https://doi.org/10.1299/jsmemecj.2020.j03117
https://doi.org/10.1299/jsmemecj.2020.j03117
Publikováno v:
The Proceedings of Mechanical Engineering Congress, Japan. 2020:J03125
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7bf805c1b1974086b950fdadd2af24d
https://doi.org/10.1299/jsmemecj.2020.j03125
https://doi.org/10.1299/jsmemecj.2020.j03125
Publikováno v:
Experimental Mechanics. 55:1081-1091
A method to estimate the creep properties by measuring the micro size deformation is required for the FEM analysis considering the creep deformation of the solder joint in-situ. An indentation creep test is one of the effective methods to directly ev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d3488bc5a1826f9c054bee0e5ed5392
https://doi.org/10.1007/s11340-015-0005-5
https://doi.org/10.1007/s11340-015-0005-5
Publikováno v:
Journal of Electronic Materials. 43:2530-2539
For the design of high-density electronic packages, finite element method (FEM) analyses to evaluate strength reliabilities of solder joints should be conducted by employing the material parameters which can precisely reflect the creep properties of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7c44b383b067d594b6f973fbe8635a5
https://doi.org/10.1007/s11664-014-3196-0
https://doi.org/10.1007/s11664-014-3196-0