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Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
Coreless packaging is an attractive option to meet the low z-height requirements typically demanded in low-profile mobile devices. In order to deliver high quality, fully functional assembled coreless packages several aspects of this technology need
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::258dc9cdbdc3ddcf74efc386ea8a512a
https://doi.org/10.1109/ectc.2012.6248940
https://doi.org/10.1109/ectc.2012.6248940
