Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Ashok Sridhar"'
Autor:
Ashok Sridhar, Michael Corbey
Publikováno v:
MAB, Vol 89, Iss 7/8, Pp 265-273 (2015)
The main objective of this paper is to compare two key approaches in the !eld of Customer Accounting (CA), namely Customer Pro!tability Analysis (CPA) and Customer Lifetime Value (CLV). While CPA is a retrospective analysis of past accruals that repr
Externí odkaz:
https://doaj.org/article/577ec3ca3e3943d0945f39be8407c60a
Publikováno v:
Acta Crystallogr F Struct Biol Commun
The BET (bromodomain and extra-terminal) family of proteins recognize the acetylated histone code on chromatin and play important roles in transcriptional co-regulation. BRD2 and BRD4, which belong to the BET family, are promising drug targets for th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ef75284f1fa8d6858592ed90db8e05e6
https://doi.org/10.1107/s2053230x22001066
https://doi.org/10.1107/s2053230x22001066
Autor:
Ashok Sridhar, Thiru Kanagasabapathi
Publikováno v:
OPE Journal. 11:20-21
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98729bee7e473b693a65f685cb705cf6
https://doi.org/10.51202/2366-8040-2021-35-020
https://doi.org/10.51202/2366-8040-2021-35-020
Autor:
Edsger C. P. Smits, Ashok Sridhar, Rajesh Mandamparambil, Sandeep Menon Perinchery, Jeroen van den Brand
Publikováno v:
Microelectronics Reliability. 55:2324-2330
The reliability of a commercially available isotropic conductive adhesive (ICA) deposited via laser induced forward transfer (LIFT) printing is reported. ICAs are particularly important for surfacemount device (SMD) integration onto low-cost, large-a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7faca64c4fde412180725fac74e50c0d
https://doi.org/10.1016/j.microrel.2015.07.006
https://doi.org/10.1016/j.microrel.2015.07.006
Publikováno v:
Thin solid films, 517(16), 4633-4637. Elsevier
Silver nanoparticle-based conductive tracks were inkjet printed using a piezoelectric drop-on-demand inkjet printer on a commercially available electronics grade fibre glass (E-glass) reinforced substrate material, and the experimental results have b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::12ea17b4d100ae791b5b8a9558e5403f
https://doi.org/10.1016/j.tsf.2009.03.133
https://doi.org/10.1016/j.tsf.2009.03.133
Publikováno v:
Transactions of the Japan Institute of Electronics Packaging, 2(1), 116-124. Erekutoronikusu Jisso Gakkai
This paper describes the optimisation of the surface characteristics of a high-frequency substrate material widely used in the PCB (printed circuit board) industry by means of CF4/O2 plasma etching, in order to make it suitable for the fabrication of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fa7f686262438f16dd28454a54eb20d4
https://doi.org/10.5104/jiepeng.2.116
https://doi.org/10.5104/jiepeng.2.116
Publikováno v:
Virtual and Physical Prototyping. 1:197-206
The use of stereolithography (SL) to make injection moulding tools has been shown previously to be an efficient way of producing rapid tools for simple geometries, aiming at small lot sizes with an acceptable degree of accuracy. This paper highlights
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ed7e36d89fc6612f397e7a84e3793a4e
https://doi.org/10.1080/17452750600924614
https://doi.org/10.1080/17452750600924614
Autor:
Jeroen Schram, J. Van Den Brand, H J van de Wiel, Ashok Sridhar, Maarten Cauwe, Roel Kusters, D. A. van den Ende
Publikováno v:
Microelectronics Reliability, 12, 54, 2860-2870
Ultra-thin chips of less than 20 μm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::987f4290f011cb2f0ddd0ae8ecf07708
http://resolver.tudelft.nl/uuid:d615f276-d513-431e-a970-89d0c09175ef
http://resolver.tudelft.nl/uuid:d615f276-d513-431e-a970-89d0c09175ef
Autor:
N. B. Palacios-Aguilera, U. Balda-Irurzun, Paddy J. French, H.A. Visser, Ashok Sridhar, L. D. Vargas-Llona, Andre Bossche, Remko Akkerman, Jiang Zhou
Publikováno v:
IEEE transactions on device and materials reliability, 13(1), 136-145. IEEE
IEEE Transactions on Device and Materials Reliability, 1, 13, 136-145
IEEE Transactions on Device and Materials Reliability, 1, 13, 136-145
Shapeable rechargeable Li-ion batteries are a good option for the power source of system-in-package devices; nevertheless, their size and temperature limitations are a constraint during the fabrication process. Inkjet-printed interconnections on top
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3df3031feb88e751a8fdcc628a19540a
https://research.utwente.nl/en/publications/92718b9d-c2e8-4fcb-9ec1-abfae83a3d33
https://research.utwente.nl/en/publications/92718b9d-c2e8-4fcb-9ec1-abfae83a3d33
Autor:
Ashok Sridhar, Bjorn Vandecasteele, Roel Kusters, Maarten Cauwe, Jeroen van den Brand, Johan De Baets
Publikováno v:
46th Annual IMAPS International Symposium on Microelectronics, IMAPS 2013, 30 September 2013 through 3 October 2013, Orlando, FL, 730-734
International Microelectronics Assembly and Packaging Society, Proceedings
International Microelectronics Assembly and Packaging Society, Proceedings
The technology development for a low-cost, roll-to-roll compatible chip embedding process is described in this paper. Target applications are intelligent labels and disposable sensor patches. Two generations of the technology are depicted. In the fir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::443d880ccf305521e04ea17690991129
http://resolver.tudelft.nl/uuid:9a6107b0-74e5-471f-94c8-22ba5b2f4b6b
http://resolver.tudelft.nl/uuid:9a6107b0-74e5-471f-94c8-22ba5b2f4b6b