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pro vyhledávání: '"Asaji Nobuhiro"'
Autor:
Ayumi Minamide, Murata Daisuke, Hodaka Rokubuichi, Asaji Nobuhiro, Morisaki Shota, Ishibashi Hidetoshi, Hiroshi Yoshida
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
Power module is used in a wide range of fields such as, home appliance, industry, railway, automobile, renewal energy, and so on. Recently, it is increasing to be required miniaturization of footprint and higher reliability to power modules. This pap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a38f0de056e76ad7d16e2e6bdd0d77cf
https://doi.org/10.23919/icep.2019.8733451
https://doi.org/10.23919/icep.2019.8733451
