Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Arvind Anumula Paramanandam"'
Autor:
Philip Godoy, Xiang Li, Wanghua Wu, Fan Zhang, Qiang Zhu, Yuan Fang, Erdem Serkan Erdogan, Ovidiu Carnu, Wai Lau, Mohammad Hajirostam, Arvind Anumula Paramanandam, David Cousinard, Daibashish Gangopadhyay, Li Lin, Hao Li, Norman Liu, Timothy Loo, Liwei Sheng, Jiexi Liu, Weiwei Xu, Haisong Wang, Renaldi Winoto, Alden Wong, Kun-Seok Lee, Arnab Mitra, Xingliang Zhao, Ashkan Olyaei, Xiaoang Li, Xiang Gao, Anuranjan Jha, Ka Wo Pang, Xiaoyue Wang, Derek Cheung, Randy Tsang, Luns Tee, Donghong Cui
Publikováno v:
ISSCC
The 2×2 wireless LAN (WLAN) + Bluetooth (BT) combo chip continues to be the most versatile product category in the wireless connectivity space. It finds usage in a wide range of applications, such as laptops, tablets, high-end smartphones, gaming co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5860b071a33dd9c22acf1d0d10eebf4
https://doi.org/10.1109/isscc.2016.7417961
https://doi.org/10.1109/isscc.2016.7417961
Autor:
Edwin Chan, Arvind Anumula Paramanandam, Kun-Seok Lee, Luns Tee, Norman Liu, Li Lin, Anuranjan Jha, Xiang Gao, Wanghua Wu
Publikováno v:
ISSCC
The fast adaptation of WiFi 802.11ac 256-QAM mode requires RF clocks with very low integrated phase error to deliver good EVM performance. On the other hand, smaller area and lower power are always desired for lower cost and longer battery life. This
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4561d3027b8fabb21c14ae0d1a0fe71
https://doi.org/10.1109/isscc.2015.7062978
https://doi.org/10.1109/isscc.2015.7062978
Autor:
Gao, Xiang, Tee, Luns, Wu, Wanghua, Lee, Kun-Seok, Paramanandam, Arvind Anumula, Jha, Anuranjan, Liu, Norman, Chan, Edwin, Lin, Li
Publikováno v:
2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers; 2015, p1-3, 3p
Autor:
He, Ming, Winoto, Renaldi, Gao, Xiang, Loeb, Wayne, Signoff, David, Lau, Wai, Lu, Yuan, Cui, Donghong, Lee, Kun-Seok, Tam, Sai-Wang, Godoy, Philip, Chen, Yung, Joo, Sanghoon, Hu, Changhui, Paramanandam, Arvind Anumula, Wang, Xiaoyue, Lin, Chi-Hung, Lin, Li
Publikováno v:
2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC); 2014, p350-351, 2p