Pb-free plating for peripheral/leadframe packages.

Autor: Nakadaira, Y., Matsuura, T., Tsuriya, M., Nhat, D.V., Kangas, R., Conrad, J., Sundram, B., Lee, K.-H., Arunasalam, S.M.

Publikováno v: Proceedings Second International Symposium on Environmentally Conscious Design & Inverse Manufacturing; 2001, p213-218, 6p