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pro vyhledávání: '"Aruna Jyothi Chamanthula"'
Autor:
Banothu Rakesh, Venkata Kiran Sanipini, N. Santoshi, A. Arunkumar Gudivada, Asisa Kumar Panigrahy, Aruna Jyothi Chamanthula
Publikováno v:
Materials Today: Proceedings. 45:1742-1746
Three Dimensional IC (3D IC) integration is one of the emerging technology which suits CMOS applications by stacking various IC layers vertically. In 3D IC, IC Layers are interconnected electrically using Through Silicon Vias (TSV’s) and mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ceaaeed8e86efff34a4512ffef85c01
https://doi.org/10.1016/j.matpr.2020.08.621
https://doi.org/10.1016/j.matpr.2020.08.621
