Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Arsalan Alam"'
Publikováno v:
IEEE Access, Vol 12, Pp 142155-142167 (2024)
The role of inter-satellite communication (ISC) is of great significance in the contemporary era of satellite technology. In this context, visible light communication (VLC) has emerged as a highly promising alternative to conventional radio frequency
Externí odkaz:
https://doaj.org/article/55de71893b3641aca09087ac36a16c5e
Autor:
Guangqi Ouyang, Amir Hanna, Samatha Benedict, Goutham Ezhilarasu, Arsalan Alam, Randall W. Irwin, Subramanian S. Iyer
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1692-1701
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14ad4119c88cc018a756bbf003b35d6a
https://doi.org/10.1109/tcpmt.2022.3207031
https://doi.org/10.1109/tcpmt.2022.3207031
Autor:
Subramanian S. Iyer, Arsalan Alam
Publikováno v:
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :233-260
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34e9958e5a5c956cacb1dbc6f864809a
https://doi.org/10.1002/9781119793908.ch10
https://doi.org/10.1002/9781119793908.ch10
Autor:
Pragathi Venkatesh, Randall Irwin, Arsalan Alam, Michael Molter, Ayush Kapoor, Bilwaj Gaonkar, Luke Macyszyn, M. Selvan Joseph, Subramanian S. Iyer
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3aa3fc9bc811c295cf9b8d625674ab78
https://doi.org/10.1109/ectc51906.2022.00357
https://doi.org/10.1109/ectc51906.2022.00357
Autor:
Luke Macyszyn, Bilwaj Gaonkar, Arsalan Alam, M. S. Joseph, M. Molter, A. Kapoor, Samatha Benedict, Subramanian S. Iyer
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
A elegant extremely flexible Fan-Out Wafer-Level Packaging (FOWLP) based fully integrated bipolar multi-channel (up to 12 channels) surface electromyography (sEMG) device and assembly is demonstrated for intraoperative neurological monitoring (IONM)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60e144cd2bfc23a4b7bc97de606323ad
https://doi.org/10.1109/ectc32696.2021.00245
https://doi.org/10.1109/ectc32696.2021.00245
Autor:
Samatha Benedict, C.S. Prajapati, Subramanian S. Iyer, Thejas K, Navakanta Bhat, Murugaiya Sridar Illango, Ashvin Nagarajan, Goutham Ezhilarasu, Arsalan Alam
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The exponentially increasing global population has led to environmental pollution which drastically affects human health; emphasizing the need for personal environmental monitoring. This demands the development of wearable devices capable of sensing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::575c6c98f6e326aebecea318e3f0f205
https://doi.org/10.1109/ectc32862.2020.00134
https://doi.org/10.1109/ectc32862.2020.00134
Autor:
Randall Irwin, M. Molter, Luke Macyszyn, Amir Hanna, Subramanian S. Iyer, Samatha Benedict, Goutham Ezhilarasu, Arsalan Alam, M. S. Joseph, Bilwaj Gaonkar
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
We demonstrate a fully integrated wireless surface electromyography (sEMG) system using Fan-Out Wafer-Level Packaging on a flexible biocompatible package with two corrugated high conductivity electroplated Cu wiring levels for efficient routing. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46ab11d882671bce2beedc52a3c25635
https://doi.org/10.1109/ectc32862.2020.00160
https://doi.org/10.1109/ectc32862.2020.00160
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper we demonstrate a 20 GHz patch antenna on the Silicon-Interconnect Fabric (Si-IF) platform. Two methodologies to integrate the antenna are explored in this paper. One is to embed a Fused Silica die inside a recess etched on the Si-IF. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e9b3525583474cbb2ee21a28b8e664c
https://doi.org/10.1109/ectc32862.2020.00279
https://doi.org/10.1109/ectc32862.2020.00279
Autor:
Samatha Benedict, Yuan Hu, Subramanian S. Iyer, Arsalan Alam, Timothy S. Fisher, Randall Irwin
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
FlexTrateTM, a flexible hybrid electronics (FHE) platform based on fan-out wafer level packaging (FOWLP) has demonstrated low die shift by using room temperature cured poly-dimethyl siloxane (PDMS) as a molding compound. In this paper, we investigate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01b8669d76b520ae5189328971ae21be
https://doi.org/10.1109/ectc32862.2020.00243
https://doi.org/10.1109/ectc32862.2020.00243
Publikováno v:
International Symposium on Microelectronics. 2018:000064-000068
A flexible fan-out wafer-level packaging (FOWLP) process for heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package (FlexTrateTM) was used to assemble 625 dies with co-planarity and tilt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c8134675879946fc29e98ae2c774ec0
https://doi.org/10.4071/2380-4505-2018.1.000064
https://doi.org/10.4071/2380-4505-2018.1.000064