Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Arnold Neckermann"'
Autor:
Constantinos Xanthopoulos, Arnold Neckermann, Klaus-Peter Tschernay, Peter Sarson, Yiorgos Makris, Paulus List
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 20:295-307
Ensuring high reliability in modern integrated circuits (ICs) requires the employment of several die screening methodologies. One such technique, commonly referred to as die inking, aims to discard devices that are likely to fail, based on their prox
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f90e6d8998aaf0adb85fcaa31652f535
https://doi.org/10.1109/tdmr.2020.2994291
https://doi.org/10.1109/tdmr.2020.2994291
Autor:
Yiorgos Makris, Arnold Neckermann, Paulus List, Klaus-Peter Tschernay, Peter Sarson, Constantinos Xanthopoulos
Publikováno v:
IOLTS
Ensuring high reliability in modern integrated circuits (ICs) requires the employment of several die screening methodologies. One such technique, commonly referred to as die inking, aims to discard devices that are likely to fail, based on their prox
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e69f0435602c61cdb5bc260a37c85e9
https://doi.org/10.1109/iolts.2019.8854373
https://doi.org/10.1109/iolts.2019.8854373