Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Arnaud Grivon"'
Publikováno v:
2014 IEEE 18th Workshop on Signal and Power Integrity (SPI)
In this paper, a detailed power integrity study is described that compares the behavior of surface-mount devices and embedded components for power decoupling. Through measurements and simulations, it is found that when the layer count of the board is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6e678a569c07416d6fdaada725115bc3
https://doi.org/10.1109/sapiw.2014.6844533
https://doi.org/10.1109/sapiw.2014.6844533
Publikováno v:
International Symposium for Testing and Failure Analysis.
The continuous miniaturization trends followed by a vast majority of electronic applications results in always denser PCBs (Printed Circuit Board) designs and PCBAs (Printed Circuit Board Assembly) with increasing solder joint densities. Current high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d50624229855a3a61268cf0ff647b638
https://doi.org/10.31399/asm.cp.istfa2012p0332
https://doi.org/10.31399/asm.cp.istfa2012p0332
Publikováno v:
Journal of Electronic Packaging
Journal of Electronic Packaging, American Society of Mechanical Engineers, 2011, 133 (3), ⟨10.1115/1.4004830⟩
Journal of Electronic Packaging, 2011, 133 (3), ⟨10.1115/1.4004830⟩
Journal of Electronic Packaging, American Society of Mechanical Engineers, 2011, 133 (3), ⟨10.1115/1.4004830⟩
Journal of Electronic Packaging, 2011, 133 (3), ⟨10.1115/1.4004830⟩
Latest electronic component package types are pushing the need to more efficiently remove the dissipated heat using optimized thermal paths going through the printed circuit board (PCB) to reach PCB inner thermal planes. So, to optimize board cooling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f959d2ba4ad3571a0fe4f04103f5537b
https://hal.archives-ouvertes.fr/hal-01699367
https://hal.archives-ouvertes.fr/hal-01699367
