Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Arnaud Castex"'
Publikováno v:
ECS Solid State Letters. 2:P47-P50
Autor:
Richard Fontaniere, Arnaud Castex, Marcel Broekaart, Chrystelle Lagahe-Blanchard, Karine Landry
Publikováno v:
ECS Transactions. 50:371-377
Significant distortion can originate during the bonding process, resulting in overlay issues for final backside illumination image sensor wafer processing, impacting final wafer yield and device reliability. This paper presents a distortion free bond
Autor:
Chrystelle Lagahe, Arnaud Castex, Richard Fontaniere, Stephane Thieffry, Karine Landry, Marcel Broekaart
Publikováno v:
ECS Transactions. 35:145-151
This paper presents a new wafer bonding process used for back side illuminated (BSI) image sensors manufacturing, with high bonding energy of 2 J/m2, without peripheral edge bonding voids that occur with the standard process.
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 26:1343-1354
As interconnects are scaled down, much effort is made to achieve ultralow k material with a dielectric constant lower than 2.5. Thus, many new precursors are investigated in plasma-enhanced chemical vapor deposition. This is particularly true with th
Autor:
Arnaud Castex, Marcel Broekaart, Stephane Thieffry, Karine Landry, Richard Fontanière, Chrystelle Lagahe
Publikováno v:
ECS Meeting Abstracts. :1157-1157
not Available.