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Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::773c3686615fff4e6669376ef8c21920
http://eprints.nottingham.ac.uk/33374/
http://eprints.nottingham.ac.uk/33374/
