Výsledky vyhledávání - "Arjan van Ijzerloo"

Degradation of Cu-Al wire bonded contacts under high current and high temperature conditions using in-situ resistance monitoring

Autor: Arjan van Ijzerloo, A. Mavinkurve, G. M. O'Halloran, R.T.H. Rongen

Publikováno v: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

To evaluate the dynamics of Cu-Al bond contact degradation, the evolution of the intermetallic electrical interface resistance was monitored in-situ in a test device exposed to high temperatures (140 to 200 °C) while conducting high current densitie

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::45e32affd2d73806256acebdb8978087
https://doi.org/10.1109/ectc.2015.7159780

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Planar Analysis of Copper-Aluminium Intermetallics

Autor: R.T.H. Rongen, Frank Zachariasse, G. M. O'Halloran, Arjan van Ijzerloo

Publikováno v: International Symposium for Testing and Failure Analysis.

This paper presents a quick, reliable, and fully quantitative method of measuring the intermetallic coverage of copper to aluminium bonding at time zero and post reliability stressing. This method is currently used in select manufacturing quality con

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::777b865a764d62ad2dc9d5e9cbcfe944
https://doi.org/10.31399/asm.cp.istfa2013p0297

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