Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Arianna Morelli"'
Autor:
Lorenzo Codecasa, Francesca De Viti, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli, Claudio Maria Villa
Publikováno v:
Energies, Vol 13, Iss 9, p 2252 (2020)
This paper presents the Thermal Resistance and Impedance Calculator (TRIC) tool devised for the automatic extraction of thermal metrics of package families of electronic components in both static and transient conditions. TRIC relies on a solution al
Externí odkaz:
https://doaj.org/article/8af5e5c1020241d7a55991a25e4f575c
Autor:
Lorenzo Codecasa, Salvatore Race, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli, Claudio Maria Villa
Publikováno v:
Energies, Vol 12, Iss 6, p 1050 (2019)
This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key
Externí odkaz:
https://doaj.org/article/94d44d407b834c73983824d281abdd7e
Autor:
Lorenzo Codecasa, Alessandro Di Costanzo, Vincenzo d’Alessandro, Roseanne Duca, Donata Gualandris, Arianna Morelli, Francesca De Viti, Claudio Maria Villa
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0014880d2ce4883bc229cf8600070c7d
https://doi.org/10.1109/therminic52472.2021.9626532
https://doi.org/10.1109/therminic52472.2021.9626532
Autor:
Emiliana Valentini, Fabio Bozzeda, Marina Antonia Colangelo, Yandy Rodríguez Cueto, Andrea Taramelli, Arianna Morelli
Increasing frequency, intensity and severity of natural hazards associated to climate change are among the pressing challenges the world is facing requiring greater resilience for communities. This challenge calls for new policies and actions at regi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a6fd044cd03bae83f59776bb95c0978d
http://hdl.handle.net/11585/836285
http://hdl.handle.net/11585/836285
Autor:
Vincenzo d'Alessandro, Claudio Maria Villa, Arianna Morelli, Francesca De Viti, Donata Gualandris, Lorenzo Codecasa
Publikováno v:
Energies, Vol 13, Iss 2252, p 2252 (2020)
Energies
Volume 13
Issue 9
Energies
Volume 13
Issue 9
This paper presents the Thermal Resistance and Impedance Calculator (TRIC) tool devised for the automatic extraction of thermal metrics of package families of electronic components in both static and transient conditions. TRIC relies on a solution al
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0448908f0a0fa3521861a8b665d0949d
http://hdl.handle.net/11588/833383
http://hdl.handle.net/11588/833383
Autor:
Vincenzo d'Alessandro, Domenico Cerracchio, Lorenzo Codecasa, Claudio Maria Villa, Donata Gualandris, Francesca De Viti, Arianna Morelli
This paper presents the thermal modeling of Ball Grid Array (BGA) package families using the Thermal Resistance and Impedance Calculator (TRIC) simulation tool. The intrinsic complexity and the great variability of the BGA families make it necessary
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9ebec36745af6ad5d4d8a8cb584864ff
http://hdl.handle.net/11311/1169429
http://hdl.handle.net/11311/1169429
Autor:
Arianna Morelli, Vincenzo d'Alessandro, Lorenzo Codecasa, Donata Gualandris, Claudio Maria Villa, Salvatore Race, Francesca De Viti
This paper presents the Thermal Resistance and Impedance Calculator (TRIC) simulation tool, extending the TRAC tool, for the automatic extraction of thermal metrics of package families of electronic components in both stationary and transient conditi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8e2b71d4407cd01c1fc8b6196ee8ea97
http://hdl.handle.net/11311/1121670
http://hdl.handle.net/11311/1121670
Autor:
Marco Rovitto, Claudio Maria Villa, Jing En Luan, Phone Maw Hla, Roseanne Duca, Arianna Morelli, Carlo Passagrilli
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Controlling warpage in backend manufacturing is a challenge that needs to be tackled in early design stage. Failure to do so may result in later manufacturability or reliability issues. This is of particular importance in BGA automotive packages wher
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdda451f73523b631f8cf3d2b1d0dff9
https://doi.org/10.1109/eptc.2018.8654402
https://doi.org/10.1109/eptc.2018.8654402
Autor:
Claudio Maria Villa, Donata Gualandris, Lorenzo Codecasa, Arianna Morelli, Vincenzo daAlessandro, Salvatore Race
Publikováno v:
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
A novel simulation tool, named Thermal Resistance Advanced Calculator, is presented Such a tool allows the straightforward definition of a parametric detailed thermal model of family of electronic packages with Manhattan geometry, in which anew therm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bd912349829b6bf63f8381c251442531
https://doi.org/10.1109/therminic.2018.8593333
https://doi.org/10.1109/therminic.2018.8593333