Zobrazeno 1 - 10
of 58
pro vyhledávání: '"Arellano, Ian Harvey"'
Publikováno v:
In Powder Technology March 2018 327:96-108
Publikováno v:
In Chemical Engineering Journal 15 March 2016 288:255-263
Publikováno v:
In Spectrochimica Acta Part A: Molecular and Biomolecular Spectroscopy 15 January 2016 153:6-15
Publikováno v:
In Chemical Engineering Journal 1 January 2016 283:692-702
Power devices in QFN platform requires efficient thermal management system. The use of conductive glue, sintered or semi-sintered adhesives, or solder materials ensure effective thermal dissipation. Herein, a new leadframe design where embossed patte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::39e2db9840a13a73fcfcbd759312dfe5
Integration of mechanical inter-locking design for leadframe-based devices is one of the available options to eliminate the delamination occurrence. In this paper, different die pad interlocking design is illustrated and discussed to cater both assem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::896c02f8aba3a2994b5e9454cb6a809f
Autor:
Arellano, Ian Harvey
Epoxy bleed-out (EBO) is a potentially deleterious failure mode emanating from the separation of epoxy glue components and their spread in the substrate. Herein, the fingerprints of a ‘disappearing’ EBO after cure were explored via surface analyt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9c88f0365eb2a2d29cbf1a4af315dcad
Component failure due to the interfacial adhesion loss is a serious concern in advanced semiconductor packages. Herein, we report the systematic failure analysis performed on a system where one component detaches from the assembly due to the adhesion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8391bfd01f0a64d7ef9a0bd7ec05daab
Autor:
Arellano, Ian Harvey
Membrane-templated deformable carrier and elastomeric encapsulant enable flexible semiconductor package in support of the demands of wearables and flexible electronic gadgets. The selectively pore-filled membrane, with metal particle suspension, is m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cbd71a3b0ee4823e254ac4b10a416d09