Zobrazeno 1 - 10
of 62
pro vyhledávání: '"Archit Shah"'
Autor:
Soumen Kar, Harrison Walker, Archit Shah, Hunter Frost, Stephen Olson, John Mucci, Jakub Nalaskowski, Brian Martinick, Sandra Schujman, Thomas Murray, Corbet S. Johnson, Ilyssa Wells, Ronald Bourque, Stanley Pierce, Ekta Bhatia, Michael C. Hamilton, Satyavolu S. Papa Rao
Publikováno v:
IEEE Transactions on Applied Superconductivity. 33:1-5
Publikováno v:
IEEE Transactions on Applied Superconductivity. 33:1-5
Autor:
Sherman E. Peek, Jacob Ward, Stephen Bankson, Archit Shah, John A. Sellers, Mark L. Adams, Michael C. Hamilton
Publikováno v:
Journal of Materials Research. 37:1978-1985
Autor:
Bhargav Yelamanchili, Archit Shah, Sherman E. Peek, Vaibhav Gupta, John A. Sellers, David B. Tuckerman, Michael C. Hamilton
Publikováno v:
IEEE Transactions on Applied Superconductivity. 32:1-5
Autor:
Babak Anasori, Jacob T. Lee, Gregory A. Davis, Rajesh Sardar, Archit Shah, Amber L. Pagan, Brian C. Wyatt, Adrianna N. Masterson
Publikováno v:
ACS Nano. 15:19600-19612
As interest continues to grow in Ti3C2Tx and other related MXenes, advancement in methods of manipulation of their surface functional groups beyond synthesis-based surface terminations (Tx: −F, −OH...
Autor:
Md. Fahim F. Chowdhury, John A. Sellers, David B. Tuckerman, Bhargav Yelamanchili, Michael C. Hamilton, Uday S. Goteti, Archit Shah, Vaibhav Gupta, Asmaul Smitha Rashid, Sherman E. Peek
Publikováno v:
IEEE Transactions on Applied Superconductivity. 31:1-6
We describe our initial approach and progress towards a reliable and useful technique to connect multiple flexible superconducting cables using a cable-to-cable connector. The test structure comprises multiple components, including flexible thin-film
Autor:
Michael C. Hamilton, Bhargav Yelamanchili, Archit Shah, Sherman E. Peek, Stephen Bankson, Chase C. Tillman
Publikováno v:
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022.
Autor:
Archit Shah, Sherman E. Peek, Bhargav Yelamanchili, Vaibhav Gupta, David B. Tuckerman, Chris Cantaloube, John A. Sellers, Michael C. Hamilton
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
FRPT- MF Snapshot. 1/2/2018, p3-3. 1/2p.
Autor:
Jacob T, Lee, Brian C, Wyatt, Gregory A, Davis, Adrianna N, Masterson, Amber L, Pagan, Archit, Shah, Babak, Anasori, Rajesh, Sardar
Publikováno v:
ACS nano. 15(12)
As interest continues to grow in Ti