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pro vyhledávání: '"Arase Takao"'
Autor:
Arase Takao, Hong-Ji Lee, Chih-Yuan Lu, Yuan-Chieh Chiu, Masahito Mori, Kuang-Chao Chen, Zusing Yang, Yinhwa Cheng, Hayato Watanabe, Li-Ian Wu, Sheng-Yuan Chang, Nan-Tzu Lian, Tahone Yang
Publikováno v:
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Dependency of asymmetric etched profiles on open-ratio and pattern-size within the wafer was studied in a magnetic Very High Frequency (VHF) Plasma etching system for high aspect-ratio multiple alternating layers of silicon oxide/polysilicon (OP) etc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01e90dde540c74658c87319af17b3e2a
https://doi.org/10.1109/asmc.2018.8373146
https://doi.org/10.1109/asmc.2018.8373146
Akademický článek
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Publikováno v:
Japanese Journal of Applied Physics. 55:06HB02
The etching of polycrystalline silicon (poly-Si)/SiO2 stacks by using VHF plasma was studied for three-dimensional NAND fabrication. One critical goal is achieving both a vertical profile and high throughput for multiple-stack etching. While the conv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::996f970ef974a0f8bbb0804f1b634c4e
https://doi.org/10.7567/jjap.55.06hb02
https://doi.org/10.7567/jjap.55.06hb02