Zobrazeno 1 - 10
of 195
pro vyhledávání: '"Ara Philipossian"'
Autor:
Jeffrey McAllister, Calliandra Stuffle, Yasa Sampurno, Dale Hetherington, Jon Sierra Suarez, Leonard Borucki, Ara Philipossian
Publikováno v:
Micromachines, Vol 10, Iss 4, p 258 (2019)
Based on a previous work where we investigated the effect of conditioner type and downforce on the evolution of pad surface micro-texture during break-in, we have chosen certain break-in conditions to carry out subsequent blanket SiO2 wafer polishing
Externí odkaz:
https://doaj.org/article/e9a0eb33d6194bd4836f7afd02c85e67
Publikováno v:
Micromachines, Vol 9, Iss 11, p 542 (2018)
We investigated the possibility of employing refractive index (RI) measurements for inline incoming slurry control at the point of use (POU), as an alternative to the widespread densitometry method. As such, it became necessary to determine if RI cou
Externí odkaz:
https://doaj.org/article/a211d521d69c4788a35080e62277a933
Publikováno v:
Micromachines, Vol 9, Iss 1, p 37 (2018)
Previous studies have shown that spectral analysis based on force data can elucidate fundamental physical phenomena during chemical mechanical planarization (CMP). While it has not been literally described elsewhere, such analysis was partly motivate
Externí odkaz:
https://doaj.org/article/eaeefd8a33b840569f1871f97f403204
Publikováno v:
Micromachines, Vol 8, Iss 6, p 170 (2017)
In this study, slurry availability and the extent of the slurry mixing (i.e., among fresh slurry, spent slurry, and residual rinse-water) were varied via three different injection schemes. An ultraviolet enhanced fluorescence technique was employed t
Externí odkaz:
https://doaj.org/article/352858adb20643af9756e946340a58b5
Autor:
Fransisca Sudargho, Ara Philipossian, Carolyn F. Graverson, Katherine M. Wortman-Otto, Yasa Sampurno, Jason J. Keleher, Sian Theng
Publikováno v:
Solid State Phenomena. 314:264-269
We have shown how different micellar (SDBS) vs. polyelectrolytic (PSSA) supramolecular assemblies in post-CMP cleaning solutions differ in their tribological performance when used in a novel PVA scrubber for 300-mm silicon dioxide wafer cleaning. Sig
A fully transient material removal model is described and applied to data from a blanket copper wafer polishing experiment. The model predicts that copper removal is primarily determined by the instantaneous power per unit area dissipated under the w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d2ed4b30788c3d5d3b1d670429c0d98
https://doi.org/10.1016/b978-0-12-821791-7.00007-1
https://doi.org/10.1016/b978-0-12-821791-7.00007-1
Autor:
Juan Cristobal Mariscal, Hossein Dadashazar, Yasa Sampurno, Jeffrey McAllister, Ara Philipossian
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:P757-P763
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:P3035-P3039
Single-run Stribeck+ curves are constructed using real-time, high-frequency, shear force and normal force data from the wafer-slurry-pad interface during copper and cobalt (on ILD wafers) CMP in conjunction with multiple slurries, pads and conditioni
Autor:
Yasa Sampurno, Juan Cristobal Mariscal, Jeffrey McAllister, Jon Sierra Suarez, Leonard Borucki, Ara Philipossian
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:P3190-P3194
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:P3133-P3144