Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Appo van der Wiel"'
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 72:1-12
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28996b6e7f2aa2d4284ef021ed12c747
https://doi.org/10.1109/tim.2023.3268486
https://doi.org/10.1109/tim.2023.3268486
Autor:
Appo van der Wiel, Tessa ten Cate, Bart van de Vorst, Jan-Willem Burssens, Anton Aulbers, Freddie Furrer, Ben van der Zon, Jian Chen, Hessel Maalderink, Mark Vaes
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Packaging of semiconductor chips, especially MEMS-based, always causes stress on the functional areas of the die causing unpredictable changes in chip performance. As a consequence such devices can only be calibrated individually after complete assem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a14307a4986cdc8f75ebb29aaff2d93a
https://doi.org/10.1109/estc.2012.6542066
https://doi.org/10.1109/estc.2012.6542066
Autor:
Appo van der Wiel
Publikováno v:
Advanced Microsystems for Automotive Applications 2003 ISBN: 9783540005971
The scope of this paper is to analyse the trade-offs for system integration for TPMS: Tire Pressure Monitoring Systems. System integration is necessary to meet the cost requirements for systems in the automotive industry.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bc2d90259c647960b5c8be4d24388c5
https://doi.org/10.1007/978-3-540-76988-0_22
https://doi.org/10.1007/978-3-540-76988-0_22
