Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Appo van der Wiel"'
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 72:1-12
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28996b6e7f2aa2d4284ef021ed12c747
https://doi.org/10.1109/tim.2023.3268486
https://doi.org/10.1109/tim.2023.3268486
Autor:
Appo van der Wiel, Tessa ten Cate, Bart van de Vorst, Jan-Willem Burssens, Anton Aulbers, Freddie Furrer, Ben van der Zon, Jian Chen, Hessel Maalderink, Mark Vaes
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Packaging of semiconductor chips, especially MEMS-based, always causes stress on the functional areas of the die causing unpredictable changes in chip performance. As a consequence such devices can only be calibrated individually after complete assem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a14307a4986cdc8f75ebb29aaff2d93a
https://doi.org/10.1109/estc.2012.6542066
https://doi.org/10.1109/estc.2012.6542066
Autor:
Appo van der Wiel
Publikováno v:
Advanced Microsystems for Automotive Applications 2003 ISBN: 9783540005971
The scope of this paper is to analyse the trade-offs for system integration for TPMS: Tire Pressure Monitoring Systems. System integration is necessary to meet the cost requirements for systems in the automotive industry.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bc2d90259c647960b5c8be4d24388c5
https://doi.org/10.1007/978-3-540-76988-0_22
https://doi.org/10.1007/978-3-540-76988-0_22
Autor:
Carl Van Buggenhout, Marc Schikowski, Anastasios Petropoulos, Roy Knechtel, Martin Behmueller, Matthias Zellmer
Publikováno v:
ECS Transactions. 86:111-118
CMOS-MEMS integration is getting a more and more important topic with growing expectations and requirements on the function and performance of micro sensors. The integration of ASICs and memories to MEMS sensor structures allows by calibration the co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b0edf84cb46cc664a0e99077813d95b
https://doi.org/10.1149/08605.0111ecst
https://doi.org/10.1149/08605.0111ecst
Autor:
Zingg, Rene
Publikováno v:
2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-3, 3p
Autor:
Wolfgang Osten, Malgorzata Kujawinska
21 years ago it was a joint idea with Hans Rottenkolber to organize a workshop dedicated to the discussion of the latest results in the automatic processing of fringe patterns. This idea was promoted by the insight that automatic and high precision p
Autor:
Jürgen Valldorf, Wolfgang Gessner
Microsystems are an important factor that contribute to an automobile model's success. To meet the customers's desire for safety, convenience and vehicle economy, and to satisfy environmental standards, microsystems are the critical factor. Microsys